MAAPGM0034-DIE MACOM [Tyco Electronics], MAAPGM0034-DIE Datasheet - Page 5

• Manufacturer Part Number: MAAPGM0034-DIE
• Description: 0.5W X/Ku-Band Power Amplifier 8.0-12.5 GHz
• Manufacturer: MACOM [Tyco Electronics]

Specifications subject to change without notice.
Email: [e-mail]
0.5W X/Ku-Band Power Amplifier
North America: Tel. [phone]
Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Bond Pad Dimensions
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
Mechanical Information
Chip Size: 2.480 x 1.580 x 0.075 mm
0.790 mm.
0.152 mm.
1.580 mm.
RF In and Out
1.428 mm.
Pad
0
Chip edge to bond pad dimensions are shown to the center of the bond pad.
0
Visit www.macom.com for additional data sheets and product information.
Figure 5. Die Layout
Size (µm)
100 x 200
200 x 150
150 x 150
(
98 x 62 x 3 mils)
MAAPGM0034-DIE
0.790 mm.
Size (mils)
4 x 8
8 x 6
6 x 6