MAAP-000076-MCH000 MACOM [Tyco Electronics], MAAP-000076-MCH000 Datasheet - Page 6

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MAAP-000076-MCH000

Manufacturer Part Number
MAAP-000076-MCH000
Description
Amplifier, Power, 16W 1.3-2.5 GHz
Manufacturer
MACOM [Tyco Electronics]
Datasheet
6
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 16W
1.3-2.5 GHz
Mechanical Information
Chip Size: 5.203 x 8.352 x 0.356 mm
Bond Pad Dimensions
DC Drain Supply Voltage VD1
DC Drain Supply Voltage VD2
DC Gate Supply Voltage VG1
DC Gate Supply Voltage VG2
RF In and Out
Pad
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Figure 17. Die Layout
Pad No.
(
205 x 329 x 14 mils)
1
2
3
4
5
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Size (μm)
200 x 250
200 x 150
500 x 200
150 x 125
100 x 100
MAAP-000076-PED000
Size (mils)
8 x 10
20 x 8
Preliminary Datasheet
4 x 8
6 x 5
4 x 4
Rev —

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