74FST3257MNTWG ON Semiconductor, 74FST3257MNTWG Datasheet - Page 8

• Manufacturer Part Number: 74FST3257MNTWG
• Description: IC MUX/DEMUX QUAD 2:1 16QFN
• Manufacturer: ON Semiconductor
• Series: 74FSTr
• Type: Multiplexer/Demultiplexerr

Specifications of 74FST3257MNTWG

• Circuit: 4 x 1:2
• Independent Circuits: 1
• Current - Output High, Low: 15mA, 64mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TFQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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16X
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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NOTE 4
2X
2X
0.10
0.08
REFERENCE
PIN ONE
0.15
16X
DETAIL A
0.15
C
C
L
C
e/2
C
É É É
É É É
É É É
2
e
BOTTOM VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
SIDE VIEW
TOP VIEW
DETAIL B
1
8
D2
D
0.15 C A B
15
10
K
E2
A
E
B
A
(A3)
0.15 C A B
A1
C
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
16X
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
SEATING
PLANE
b
L1
0.10 C
0.05 C
EXPOSED Cu
http://onsemi.com
CASE 485AW−01
MN SUFFIX
ALTERNATE TERMINAL
ISSUE O
QFN16
Ç Ç Ç
É É É
CONSTRUCTIONS
CONSTRUCTIONS
A B
NOTE 3
DETAIL B
ALTERNATE
DETAIL A
8
L
*For additional information on our Pb−Free strategy and soldering
MOLD CMPD
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
2.80
0.60
16X
1.10
L
SOLDERING FOOTPRINT*
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
DIM
A1
A3
D2
E2
L1
A
D
K
b
E
e
L
3.80
2.10
DIMENSIONS: MILLIMETERS
MILLIMETERS
MIN
0.80
0.00
0.20
0.85
1.85
0.20
0.35
---
2.50 BSC
0.20 REF
3.50 BSC
0.50 BSC
0.30
16X
MAX
1.00
0.05
0.30
1.15
2.15
0.45
0.15
---
PACKAGE
OUTLINE
74FST3257/D
0.50
PITCH