CBT3251D,112 NXP Semiconductors, CBT3251D,112 Datasheet - Page 14
![IC 1-OF-8 FET MUX/DEMUX 16-SOIC](/photos/6/52/65286/16-soic_sot109-1_sml.jpg)
CBT3251D,112
Manufacturer Part Number
CBT3251D,112
Description
IC 1-OF-8 FET MUX/DEMUX 16-SOIC
Manufacturer
NXP Semiconductors
Series
74CBTr
Type
FET Multiplexer/Demuxr
Datasheet
1.CBT3251D112.pdf
(16 pages)
Specifications of CBT3251D,112
Package / Case
16-SOIC (3.9mm Width)
Circuit
1 x 1:8
Independent Circuits
1
Current - Output High, Low
15mA, 64mA
Voltage Supply Source
Single Supply
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Product
Multiplexer
Logic Family
CBT
Number Of Lines (input / Output)
8.0 / 1.0
Propagation Delay Time
0.25 ns at 5 V
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Input Lines
8.0
Number Of Output Lines
1.0
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-3626-5
935274113112
CBT3251D
935274113112
CBT3251D
Philips Semiconductors
14. Abbreviations
15. Revision history
Table 11:
CBT3251_1
Product data sheet
Document ID
CBT3251_1
Revision history
Release date
20051221
[4]
[5]
[6]
[7]
[8]
[9]
Table 10:
Acronym
CDM
ESD
FET
HBM
MM
PRR
TTL
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Data sheet status
Product data sheet
Description
Charged Device Model
ElectroStatic Discharge
Field-Effect Transistor
Human Body Model
Machine Model
Pulse Repetition Rate
Transistor-Transistor Logic
Rev. 01 — 21 December 2005
Change notice
-
1-of-8 FET multiplexer/demultiplexer
Doc. number
-
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Supersedes
-
CBT3251
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