MT47H64M16HR-3AIT:H Micron Semiconductor Products, MT47H64M16HR-3AIT:H Datasheet

MT47H64M16HR-3AIT:H

Manufacturer Part Number

MT47H64M16HR-3AIT:H

Description

64MX16 DDR2 SDRAM PLASTIC IND TEMP PBF FBGA 1.8V

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT47H64M16HR3AITH.pdf (129 pages)

Specifications of MT47H64M16HR-3AIT:H

Pack_quantity

228

Comm_code

85423239

Lead_time

Eccn

EAR99

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Price

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MT47H64M16HR-3AIT:H

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MICRON

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MT47H64M16HR-3AIT:H

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Automotive DDR2 SDRAM

MT47H128M8 – 16 Meg x 8 x 8 banks

MT47H64M16 – 8 Meg x 16 x 8 banks

Features

• Industrial and automotive temperature compliant

• V

• JEDEC-standard 1.8V I/O (SSTL_18-compatible)

• Differential data strobe (DQS, DQS#) option

• 4n-bit prefetch architecture

• Duplicate output strobe (RDQS) option for x8

• DLL to align DQ and DQS transitions with CK

• 8 internal banks for concurrent operation

• Programmable CAS latency (CL)

• Posted CAS additive latency (AL)

• WRITE latency = READ latency - 1

• Programmable burst lengths (BL): 4 or 8

• Adjustable data-output drive strength

• 32ms, 8192-cycle refresh

• On-die termination (ODT)

• RoHS-compliant

• AEC-Q100

• PPAP submisson

• 8D response time

Table 1: Key Timing Parameters

PDF: 09005aef840eff89

1gbddr2_ait_aat.pdf – Rev. C 7/11 EN

= 1.8V ±0.1V, V

Speed Grade

-25E

-25

-3E

-3

Products and specifications discussed herein are subject to change by Micron without notice.

DDQ

= 1.8V ±0.1V

CL = 3

400

CL = 4

533

667

533

Data Rate (MT/s)

CL = 5

Options

• Configuration

• FBGA package (Pb-free) – x8

• FBGA package (Pb-free) – x16

• FBGA package (lead solder) – x8

• FBGA package (lead solder) – x16

• Timing – cycle time

• Self refresh

• Operating temperature

• Revision

1Gb: x8, x16 Automotive DDR2 SDRAM

800

667

– 128 Meg x 8 (16 Meg x 8 x 8 banks)

– 64 Meg x 16 (8 Meg x 16 x 8 banks)

– 60-ball FBGA (8mm x 10mm) Rev. H

– 84-ball FBGA (8mm x 12.5mm) Rev.

– 60-ball FBGA (8mm x 10mm) Rev. H

– 84-ball FBGA (8mm x 12.5mm) Rev.

– 2.5ns @ CL = 5 (DDR2-800)

– 3.0ns @ CL = 5 (DDR2-667)

– Standard

– Low-power

– Industrial (–40°C ≤ T

– Automotive (–40°C ≤ T

Note:

–40°C ≤ T

+105ºC)

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

product offerings and availability.

CL = 6

800

n/a

≤ +85°C)

≤ +95°C;

CL = 7

, T

n/a

www.micron.com

≤

Marking

RC (ns)

Features

128M8

64M16

None

-25E

AAT

AIT

-3

for

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