MT46H4M32LFB5-6IT:K Micron Semiconductor Products, MT46H4M32LFB5-6IT:K Datasheet

MT46H4M32LFB5-6IT:K

Manufacturer Part Number

MT46H4M32LFB5-6IT:K

Description

Mobile DDR 4Mx32, 166MHz (DDR333), 1.8V, FBGA90, Ind. Temp, leadfree

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT46H4M32LFB5-6ITK.pdf (94 pages)

Specifications of MT46H4M32LFB5-6IT:K

Package

Tray/TW

Unit

1000

Date_code

08+

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MT46H4M32LFB5-6IT:K

Manufacturer:

PNL

Quantity:

3 447

Current page: 1 of 94
Download datasheet (4Mb)

Mobile Low-Power DDR SDRAM

MT46H8M16LF – 2 Meg x 16 x 4 Banks

MT46H4M32LF – 1 Meg x 32 x 4 Banks

Features

• V

• Bidirectional data strobe per byte of data (DQS)

• Internal, pipelined double data rate (DDR) architec-

• Differential clock inputs (CK and CK#)

• Commands entered on each positive CK edge

• DQS edge-aligned with data for READs; center-

• 4 internal banks for concurrent operation

• Data masks (DM) for masking write data; one mask

• Programmable burst lengths (BL): 2, 4, 8, or 16

• Concurrent auto precharge option is supported

• Auto refresh and self refresh modes

• 1.8V LVCMOS-compatible inputs

• Temperature-compensated self refresh (TCSR)

• Partial-array self refresh (PASR)

• Deep power-down (DPD)

• Status read register (SRR)

• Selectable output drive strength (DS)

• Clock stop capability

• 64ms refresh

PDF: 09005aef8331b3e9

128mb_mobile_ddr_sdram_t35m.pdf - Rev. F 03/10 EN

ture; two data accesses per clock cycle

aligned with data for WRITEs

per byte

Table 1: Key Timing Parameters (CL = 3)

Speed Grade

DDQ

-54

-75

-5

-6

= 1.70–1.95V

Products and specifications discussed herein are subject to change by Micron without notice.

Clock Rate

200 MHz

185 MHz

166 MHz

133 MHz

Access Time

5.0ns

6.0ns

128Mb: x16, x32 Mobile LPDDR SDRAM

Notes:

Options

• V

• Configuration

• Row size option

• Plastic "green" package

• Timing – cycle time

• Operating temperature range

• Design revision

– 1.8V/1.8V

– 8 Meg x 16 (2 Meg x 16 x 4

– 4 Meg x 32 (1 Meg x 32 x 4

– JEDEC-standard option

– 60-ball VFBGA (8mm x 9mm)

– 90-ball VFBGA (8mm x 13mm)

– 5ns @ CL = 3 (200 MHz)

– 5.4ns @ CL = 3 (185 MHz)

– 6ns @ CL = 3 (166 MHz)

– 7.5ns @ CL = 3 (133 MHz)

– Commercial (0˚ to +70˚C)

– Industrial (–40˚C to +85˚C)

Micron Technology, Inc. reserves the right to change products or specifications without notice.

banks)

1. Only available for x16 configuration.

2. Only available for x32 configuration.

DDQ

Marking

Features

8M16

4M32

None

-54

-75

-5

-6

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