HEF4538BP,652 NXP Semiconductors, HEF4538BP,652 Datasheet
HEF4538BP,652
Specifications of HEF4538BP,652
933507950652
HEF4538BPN
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HEF4538BP,652 Summary of contents
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HEF4538B Dual precision monostable multivibrator Rev. 7 — 17 February 2011 1. General description The HEF4538B is a dual retriggerable-resettable monostable multivibrator. Each multivibrator has an active LOW trigger/retrigger input (nA), an active HIGH trigger/retrigger input (nB), an overriding active ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information All types operate from +125 Type number Package Name HEF4538BP DIP16 HEF4538BT SO16 5. Functional diagram Fig 1. Functional diagram HEF4538B Product data sheet C. Description plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 3.9 mm ...
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... NXP Semiconductors nREXT/CEXT nCEXT V SS nCD Fig 2. Logic diagram (one multivibrator) 6. Pinning information 6.1 Pinning Fig 3. Pin configuration HEF4538B Product data sheet V ref1 enable V ref2 enable HEF4538B 16 1CEXT 1 1REXT/CEXT 1CD 001aae733 All information provided in this document is subject to legal disclaimers. Rev. 7 — 17 February 2011 ...
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... NXP Semiconductors 6.2 Pin description Table 2. Pin description Symbol 1CEXT, 2CEXT 1REXT/CEXT, 2REXT/CEXT 1CD, 2CD 1B, 2B 1A, 2A 1Q Functional description Table 3. Function table Inputs nA nB L [ HIGH voltage level LOW voltage level don’t care; = positive-going transition; = negative-going transition; ...
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... NXP Semiconductors (1) nB input nA input nCD input nREXT/CEXT input V ref1 nQ output T (5) (1) Positive edge triggering. (2) Positive edge re-triggering (pulse lengthening). (3) Negative edge triggering. (4) Reset (pulse shortening). EXT EXT Fig 4. Timing diagram Fig 5. Connection of the external timing components R 8. Limiting values Table 4 ...
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... NXP Semiconductors Table 4. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to V Symbol Parameter T ambient temperature amb P total power dissipation tot P power dissipation derates linearly with 12 mW/K above 70 C. [1] For DIP16 package: P tot derates linearly with 8 mW/K above 70 C. ...
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... NXP Semiconductors Table 6. Static characteristics unless otherwise specified Symbol Parameter Conditions I HIGH-level output current LOW-level output current input leakage nREXT/CEXT I current C input I capacitance Table 7. Typical static characteristics amb Symbol Parameter I supply current DD C input capacitance I [1] Only one monostable is switching: for the specified current during the output pulse (output nQ is HIGH) ...
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... NXP Semiconductors Table 8. Dynamic characteristics for test circuit see SS amb Symbol Parameter Conditions t recovery time nCD to nA, nB; rec see Figure 7 t retrigger time nQ nA, nB; rtrig see Figure 7 t pulse width nA LOW; minimum width; W see Figure 7 nB HIGH; minimum width; see Figure 7 nCD LOW ...
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... NXP Semiconductors 12. Waveforms input input nCD input PLH output PHL output Measurement points are given in Logic levels: V and Fig 6. Waveforms showing propagation delays Table 9. Measurement points Supply voltage HEF4538B Product data sheet PLH PHL Table 9. are typical output levels that occur with the output load. ...
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... NXP Semiconductors V I nCD input input input output V OL Measurement points are given in Set-up and recovery times are shown as positive values but may be specified as negative values. Logic levels: V and Fig 7. Waveforms showing minimum nA, nB, and nQ pulse widths and set-up, recovery and retrigger times ...
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... NXP Semiconductors 3 Δt W (%) 2 (1) 1 (2) 0 (3) −1 −2 −80 − 100 k 100 nF EXT EXT ( ( ( and Fig 8. Typical normalized change in output pulse width as a function of ambient temperature 3 (1) Δt W (%) 2 ( −1 − C; amb W ( nF. EXT ( 100 nF. EXT Fig 9. ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit load capacitance including jig and probe capacitance termination resistance should be equal to the output impedance Z T Fig 11. Test circuit Table 10. Test data Supply voltage Input HEF4538B Product data sheet DUT R T 10. ...
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... NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description DUT Device Under Test 15. Revision history Table 12. Revision history Document ID Release date HEF4538B v.7 20110217 • Modifications: Table • Table from milliseconds to seconds. HEF4538B v.6 20091102 HEF4538B v.5 20090304 HEF4538B v.4 20090206 HEF4538B_CNV v.3 19950101 HEF4538B_CNV v ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales office addresses, please send an email to: HEF4538B Product data sheet 16 ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Package outline ...