AM29LV128MH AMD [Advanced Micro Devices], AM29LV128MH Datasheet - Page 8

• Manufacturer Part Number: AM29LV128MH
• Manufacturer: AMD [Advanced Micro Devices]

CONNECTION DIAGRAMS
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (TSOP and BGA). The package
and/or data integrity may be compromised if the
6
RY/BY#
A13
WE#
NC
A5
A4
A3
A2
A1
NC
A8
A7
A6
A9
A7
A3
WP#/ACC
RESET#
A22
A12
A17
NC
B8
B7
B6
A8
B5
B4
B3
B2
A4
B1
A14
A10
A21
A18
NC
NC
A6
A2
C8
C7
C6
C5
C4
C3
C2
C1
Top View, Balls Facing Down
D A T A S H E E T
64- Ball Fortified BGA
Am29LV128MH/L
A15
A11
A19
A20
V
NC
D8
D7
D6
D5
D4
D3
A5
D2
A1
D1
IO
DQ7
DQ5
DQ2
DQ0
A16
V
NC
E8
E7
E6
E5
E4
E3
E2
A0
E1
package body is exposed to temperatures above
150 ° C for prolonged periods of time.
SS
BYTE#
DQ14
DQ12
DQ10
DQ8
CE#
NC
V
F8
F7
F6
F5
F4
F3
F2
F1
IO
DQ15/A-1
DQ13
DQ11
DQ9
OE#
V
NC
G8
G7
G6
G5
G4
G3
G2
G1
NC
CC
DQ6
DQ4
DQ3
DQ1
V
V
H8
NC
H7
H6
H5
H4
H3
H2
H1
NC
SS
SS
September 9, 2003