EVAL-ADG936-REB AD [Analog Devices], EVAL-ADG936-REB Datasheet - Page 14

• Manufacturer Part Number: EVAL-ADG936-REB
• Description: Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT
• Manufacturer: AD [Analog Devices]

ADG936/ADG936-R
ORDERING GUIDE
Model
ADG936BRU
ADG936BRU-500RL7
ADG936BRU-REEL
ADG936BRU-REEL7
ADG936BCP
ADG936BCP-500RL7
ADG936BCP-REEL
ADG936BCP-REEL7
ADG936BRU-R
ADG936BRU-R-500RL7
ADG936BRU-R-REEL
ADG936BRU-R-REEL7
ADG936BCP-R
ADG936BCP-R-500RL7
ADG936BCP-R-REEL
ADG936BCP-R-REEL7
EVAL-ADG936EB
EVAL-ADG936-REB
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Rev. 0 | Page 14 of 16
Package Description
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
Evaluation Board
Package Option
RU-20
RU-20
RU-20
RU-20
CP-20-1
CP-20-1
CP-20-1
CP-20-1
RU-20
RU-20
RU-20
RU-20
CP-20-1
CP-20-1
CP-20-1
CP-20-1
RU-20
RU-20