AM29F100B-120DGC1 AMD [Advanced Micro Devices], AM29F100B-120DGC1 Datasheet - Page 5

• Manufacturer Part Number: AM29F100B-120DGC1
• Description: 1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1
• Manufacturer: AMD [Advanced Micro Devices]

ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29F100T-120
Am29F100B-120
Am29F100
Valid Combinations
T
DWC 1, DWI 1, DWE 1
DGC 1, DGI 1, DGE 1,
DPC 1, DPI 1, DPE 1,
DTC 1, DTI 1, DTE 1,
-120
DP
Am29F100 Known Good Die
S U P P L E M E N T
DEVICE NUMBER/DESCRIPTION
Am29F100 Known Good Die
1 Megabit (128 K x 8-Bit/64K x 16-Bit) CMOS Flash Memory—Die Revision 1
5.0 Volt-only Program and Erase
C
1
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
DIE REVISION
This number refers to the specific AMD manufacturing
process and product technology reflected in this
document. It is entered in the revision field of AMD
standard product nomenclature.
TEMPERATURE RANGE
C = Commercial (0 C to +70 C)
I = Industrial (–40 C to +85 C)
E = Extended (–55 C to +125 C)
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP = Waffle Pack
DG = Gel-Pak
DT = Surftape™ (Tape and Reel)
DW = Gel-Pak
SPEED OPTION
See Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
Call AMD sales office for minimum order
quantity
180 die per 5 tray stack
420 die per 6 tray stack
1600 per 7-inch reel
Valid Combinations
®
®
Die Tray
Wafer Tray (sawn wafer on frame)
5