AM29F100B-120DGC1 AMD [Advanced Micro Devices], AM29F100B-120DGC1 Datasheet

AM29F100B-120DGC1

Manufacturer Part Number

AM29F100B-120DGC1

Description

1 Megabit (128 K x 8-Bit/64 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1

Manufacturer

AMD [Advanced Micro Devices]

Datasheet

1.AM29F100B-120DGC1.pdf (8 pages)

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Am29F100 Known Good Die

1 Megabit (128 K x 8-Bit/64 K x 16-Bit)

CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1

DISTINCTIVE CHARACTERISTICS

Single power supply operation

— 5.0 V

— Simplifies system-level power requirements

High performance

— 120 ns maximum access time

Low power consumption

— 20 mA typical active read current for byte mode

— 28 mA typical active read current for word mode

— 30 mA typical program/erase current

— 25 A typical standby current

Flexible sector architecture

— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and

— One 8 Kword, two 4 Kword, one 16 Kword, and

— Any combination of sectors can be erased

— Supports full chip erase

Top or bottom boot block configurations

available

Sector protection

— Hardware-based feature that disables/re-

— Sector protection/unprotection can be

— Temporary Sector Unprotect feature allows in-

operations

one 64 Kbyte sectors (byte mode)

one 32 Kword sectors (word mode)

enables program and erase operations in any

combination of sectors

implemented using standard PROM

programming equipment

system code changes in protected sectors

SUPPLEMENT

10% for read, erase, and program

Embedded Algorithms

— Embedded Erase algorithm automatically

— Embedded Program algorithm automatically

Minimum 100,000 program/erase cycles

guaranteed

Compatible with JEDEC standards

— Pinout and software compatible with

— Superior inadvertent write protection

Data Polling and Toggle Bits

— Provides a software method of detecting

Ready/Busy pin (RY/BY#)

— Provides a hardware method for detecting

Erase Suspend/Erase Resume

— Suspends an erase operation to read data from,

Hardware RESET# pin

— Hardware method of resetting the device to

Tested to datasheet specifications at

temperature

Quality and reliability levels equivalent to

standard packaged components

pre-programs and erases the chip or any

combination of designated sector

programs and verifies data at specified address

single-power-supply flash

program or erase cycle completion

or program data to, a sector that is not being

erased, then resumes the erase operation

reading array data

Publication# 21235

Issue Date: January 1998

Rev: B Amendment/0

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AM29F100B-120DGC1 Summary of contents

Page 1

SUPPLEMENT Am29F100 Known Good Die 1 Megabit (128 K x 8-Bit/ 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS Single power supply operation — 5.0 V 10% for read, erase, and program operations — ...

Page 2

GENERAL DESCRIPTION The Am29F100 in Known Good Die (KGD) form Mbit, 5.0 Volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reli- ability ...

Page 3

PRODUCT SELECTOR GUIDE Family Part Number Speed Option (V = 5.0 V 10%) CC Max Access Time, t (ns) ACC Max CE# Access, t (ns) CE Max OE# Access, t (ns) OE DIE PHOTOGRAPH Orientation relative to top left corner ...

Page 4

PAD DESCRIPTION Pad Signal DQ4 3 DQ12 4 DQ5 5 DQ13 6 DQ6 7 DQ14 DQ7 DQ15 BYTE# 15 A15 16 A14 17 A13 ...

Page 5

... AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: T -120 Am29F100 Valid Combinations DPC 1, DPI 1, DPE 1, Am29F100T-120 DGC 1, DGI 1, DGE 1, Am29F100B-120 DTC 1, DTI 1, DTE 1, DWC 1, DWI 1, DWE DIE REVISION This number refers to the specific AMD manufacturing process and product technology reflected in this document ...

Page 6

PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F100 product qualification database supplement for KGD. AMD implements quality assurance proce- dures throughout the product test flow. ...

Page 7

PHYSICAL SPECIFICATIONS Die dimensions . . . . . . . . . . . . . . 266 mils x 142 mils . . . . . . . . . . . . . . . . . ...

Page 8

TERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIE All transactions relating to AMD Products under this agreement shall be subject to AMD’s standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right ...

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