LTM4609 LINER [Linear Technology], LTM4609 Datasheet - Page 19

• Manufacturer Part Number: LTM4609
• Description: 36VIN, 34VOUT High Effi ciency Buck-Boost DC/DC ?Module
• Manufacturer: LINER [Linear Technology]

TYPICAL APPLICATIONS
APPLICATIONS INFORMATION
Table 4. Boost Mode
DERATING CURVE
Figure 7, 9
Figure 7, 9
Figure 7, 9
Figure 8, 10
Figure 8, 10
Figure 8, 10
Table 5. Buck Mode
DERATING CURVE
Figure 11, 13
Figure 11, 13
Figure 11, 13
Figure 12, 14
Figure 12, 14
Figure 12, 14
HEAT SINK MANUFACTURER
Wakefi eld Engineering
Aaivd Thermalloy
*The results of thermal resistance from junction to ambient θ
as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has to be
mentioned that poor board design may increase the θ
Figure 13. 36V
0
8
7
6
5
4
3
2
1
25
35
36V
36V
36V
AMBIENT TEMPERATURE (°C)
IN
IN
IN
45
IN
TO 20V
TO 20V
TO 20V
to 20V
V
V
55
16, 30
16, 30
16, 30
16, 30
16, 30
16, 30
12, 20
12, 20
12, 20
12, 20
12, 20
12, 20
OUT
OUT
OUT
OUT
OUT
65
(V)
(V)
OUT
WITH 0LFM
WITH 200LFM
WITH 400LFM
75
without Heat Sink
85
95
POWER LOSS CURVE
POWER LOSS CURVE
PART NUMBER
LTN20069
375424B00034G
4609 F13
JA
.
105
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
JA
are based on the demo board DC 1198A. Thus, the maximum temperature on board is treated
AIR FLOW (LFM)
AIR FLOW (LFM)
200
400
200
400
200
400
200
400
0
0
0
0
Figure 14. 36V
8
7
6
5
4
3
2
1
0
25
PHONE NUMBER
603-635-2800
603-224-9988
35
36V
36V
36V
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
AMBIENT TEMPERATURE (°C)
IN
HEAT SINK
HEAT SINK
IN
IN
IN
45
TO 20V
TO 20V
TO 20V
to 20V
None
None
None
None
None
None
55
OUT
OUT
OUT
OUT
65
WITH 0LFM
WITH 200LFM
WITH 400LFM
with Heat Sink
75
85
LTM4609
95
4609 F14
θ
θ
JA
JA
105
11.4
11.0
(°C/W)*
(°C/W)*
8.5
7.5
7.9
7.1
8.2
5.9
5.4
7.5
5.3
4.8
19
4609fa