UPG2106 NEC, UPG2106 Datasheet - Page 11

• Manufacturer Part Number: UPG2106
• Description: L-BAND PA DRIVER AMPLIFIER
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Method
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Preliminary Data Sheet P14318EJ1V0DS00
Note
Soldering Conditions
Note
Note
Note
PG2106TB, PG2110TB
Recommended Condition Symbol
For soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3
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