EP7309-CR-C Cirrus Logic, EP7309-CR-C Datasheet - Page 26

no-image

EP7309-CR-C

Manufacturer Part Number
EP7309-CR-C
Description
HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
Manufacturer
Cirrus Logic
Datasheet
EP7309
High-Performance, Low-Power System on Chip
204-Ball TFBGA Package Characteristics
204-Ball TFBGA Package Specifications
26
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
C
1
A1 CORNER
2 3
4 5 6
TOP VIEW
SEATING PLANE
7 8
9 10 11
12 13
14 15
Copyright 2001 Cirrus Logic (All Rights Reserved)
16
17
Figure 12. 204-Ball TFBGA Package
18
19 20
A
B
Ø0.25~0.35(204X)
Ø0.15 M C A B
20
19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Ball Pitch :
Ball Diameter :
BOTTOM VIEW
13±0.05
12.35
0.65
0.3
Substrate Thickness :
Mold Thickness :
A1 CORNER
0.65
DS507PP1
0.36
0.53
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y

Related parts for EP7309-CR-C