TDA3566 Philips Semiconductors, TDA3566 Datasheet - Page 21

• Manufacturer Part Number: TDA3566
• Description: PAL/NTSC decoder
• Manufacturer: Philips Semiconductors

Philips Semiconductors
SOLDERING
Plastic dual in-line packages
B
The maximum permissible
temperature of the solder is 260 C;
this temperature must not be in
contact with the joint for more than
5 s. The total contact time of
successive solder waves must not
exceed 5 s.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
February 1994
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Y DIP OR WAVE
PAL/NTSC decoder
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
The device may be mounted up to the
seating plane, but the temperature of
the plastic body must not exceed the
specified storage maximum. If the
printed-circuit board has been
pre-heated, forced cooling may be
necessary immediately after
soldering to keep the temperature
within the permissible limit.
21
R
Apply the soldering iron below the
seating plane (or not more than 2 mm
above it. If its temperature is below
300 C, it must not be in contact for
more than 10 s; if between 300 and
400 C, for not more than 5 s.
EPAIRING SOLDERED JOINTS
Product specification
TDA3566A