UPD4702G NEC, UPD4702G Datasheet - Page 10

• Manufacturer Part Number: UPD4702G
• Description: INCREMENTAL ENCODER 8-BIT UP/DOWN COUNTER CMOS INTEGRATED CIRCUITS
• Manufacturer: NEC

10
RECOMMENDED SOLDERING CONDITIONS
different conditions.
TYPES OF SURFACE MOUNT DEVICE
* Exposure limit before soldering after dry-pack package is opened.
Note Do not apply more than a single process at once, except for “Partial heating method”.
TYPES OF THROUGH HOLE MOUNT DEVICE
REFERENCE
PD4702G
PD4702C
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (IEI-1207).
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Wave soldering
NEC semiconductor device reliability/quality control system
Quality grade on NEC semiconductor devices
Semiconductor device mounting technology manual
Semiconductor device package manual
Guide to quality assurance for semiconductor devices
Semiconductor selection guide
Storage conditions: 25 C and relative humidity at 65 % or less.
Soldering process
Soldering process
Peak package’s surface temperature: 235 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 2, Exposure limit*: None
Peak package’s surface temperature: 215 C or below,
Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 2, Exposure limit*: None
Solder temperature: 260 C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit*: None
Terminal temperature: 300 C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Solder temperature: 260 C or below,
Flow time: 10 seconds or below
Dcodument name
Soldering conditions
Soldering conditions
Document No.
IEI-1212
IEI-1209
IEI-1207
IEI-1213
MEI-1202
MF-1134
IR35-00-2
VP15-00-2
WS60-00-1
Symbol
Symbol
PD4702