ADG511 Analog Devices, ADG511 Datasheet - Page 5

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ADG511

Manufacturer Part Number
ADG511
Description
LC2MOS Precision 5 V/3 V Quad SPST Switches
Manufacturer
Analog Devices
Datasheet

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REV. B
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog, Digital Inputs
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG511/ADG512/ADG513 features proprietary ESD protection circuitry,
permanent damage may occur on devices subjected to high energy electrostatic discharges.
Therefore, proper ESD precautions are recommended to avoid performance degradation or loss
of functionality.
DD
DD
SS
A
Industrial (B Version) . . . . . . . . . . . . . . . . . –40 C to +85 C
Extended (T Version) . . . . . . . . . . . . . . . . –55 C to +125 C
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . +300 C
JA
= +25 C unless otherwise noted)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 76 C/W
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
2
. . . . . . . . . . . V
Model
ADG511BN
ADG511BR
ADG511ABR
ADG511TQ
ADG512BN
ADG512BR
ADG512ABR
ADG512TQ
ADG513BN
ADG513BR
ADG513ABR
NOTES
1
2
3
4
For availability of MIL-STD-883, Class B processed parts, contact factory.
3.3 V specifications apply over 0 C to +70 C temperature range.
N = Plastic DIP; R = 0.15" Small Outline IC (SOIC); Q = Cerdip.
Trench isolated latch-up proof parts. See Trench Isolation section.
30 mA, Whichever Occurs First
1
1
SS
4
4
4
4
4
–2 V to V
DD
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
Temperature Range
–40 C to +85 C
–40 C to +85 C
–55 C to +125 C
–40 C to +85 C
–40 C to +85 C
–55 C to +125 C
–40 C to +85 C
–40 C to +85 C
+ 2 V or
ORDERING GUIDE
–5–
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
limited to the maximum ratings given.
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 C
Lead Temperature, Soldering
JA
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 117 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77 C/W
2
Package Option
N-16
R-16A
R-16A
Q-16
N-16
R-16A
R-16A
Q-16
N-16
R-16A
R-16A
ADG511/ADG512/ADG513
3
WARNING!
ESD SENSITIVE DEVICE

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