UPB1513TU-E2 ETC1 [List of Unclassifed Manufacturers], UPB1513TU-E2 Datasheet - Page 9

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UPB1513TU-E2

Manufacturer Part Number
UPB1513TU-E2
Description
FOR SATELLITE COMMUNICATIONS DIVIDE BY 4 PRESCALER IC FOR SATELLITE COMMUNICATIONS
Manufacturer
ETC1 [List of Unclassifed Manufacturers]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPB1513TU-E2-A
Quantity:
1 981
NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
Infrared Reflow
Wave Soldering
Partial Heating
Caution
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
(3) Keep the track length of the ground terminals as short as possible.
(4) Bypass capacitance must be attached to V
(5) Exposed heat sink at bottom on package must be soldered to PCB RF/DC ground.
Soldering Method
oscillation).
Do not use different soldering methods together (except for partial heating).
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
CC
Soldering Conditions
line.
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
WS260
HS350
IR260
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
01/04/05

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