2SK3700_09 TOSHIBA [Toshiba Semiconductor], 2SK3700_09 Datasheet

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2SK3700_09

Manufacturer Part Number
2SK3700_09
Description
Switching Regulator Applications
Manufacturer
TOSHIBA [Toshiba Semiconductor]
Datasheet
Switching Regulator Applications
Absolute Maximum Ratings
Thermal Characteristics
Low drain-source ON-resistance: R
High forward transfer admittance: |Y
Low leakage current: I
Enhancement model: V
Drain-source voltage
Drain-gate voltage (R
Gate-source voltage
Drain current
Drain power dissipation (Tc=25°C)
Single pulse avalanche energy
Avalanche current
Repetitive avalanche energy (Note 3)
Channel temperature
Storage temperature range
Note:
Thermal resistance, channel to case
Thermal resistance, channel to ambient
Note 1: Ensure that the temperature does not exceed 150℃.
Note 2: V
Note 3: Repetitive rating: pulse width limited by maximum channel temperature
This transistor is an electrostatic-sensitive device. Please handle with caution.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Characteristics
DD
Characteristics
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-MOSⅣ)
= 90 V, T
GS
DC
Pulse (Note 1)
DSS
= 20 kΩ)
th
ch
= 2.0 to 4.0 V (V
= 25°C (initial), L = 25.7mH, R
= 100 μA (max) (V
(Note 1)
(Note 2)
DS (ON)
fs
(Ta = 25°C)
| = 4.5 S (typ.)
Symbol
V
V
V
E
E
T
I
I
T
DGR
P
DSS
GSS
DP
AR
I
AS
AR
stg
D
ch
R
R
D
DS
2SK3700
Symbol
th (ch-a)
th (ch-c)
= 2.0 Ω (typ.)
DS
= 10 V, I
= 720 V)
−55 to150
Rating
D
900
900
±30
150
351
150
15
15
1
= 1 mA)
5
5
G
0.833
Max
= 25 Ω, I
50
AR
Unit
mJ
mJ
°C/W
°C/W
°C
°C
W
V
V
V
A
A
Unit
= 5 A
Weight: 4.6 g (typ.)
JEDEC
JEITA
TOSHIBA
1. GATE
2. DRAIN (HEAT SINK)
3. SOURCE
2-16C1B
2009-09-29
2SK3700
Unit: mm

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2SK3700_09 Summary of contents

Page 1

TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-MOSⅣ) Switching Regulator Applications • Low drain-source ON-resistance: R • High forward transfer admittance: |Y • Low leakage current 100 μA (max) (V DSS • Enhancement model ...

Page 2

Electrical Characteristics (Ta = 25°C) Characteristics Gate leakage current Gate-source breakdown voltage Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-ON time Switching time ...

Page 3

I – Common source 25°C 10 Pulse Test 4 Drain-source voltage V DS (V) I – V ...

Page 4

R – (ON) 10 COMMON SOURCE PULSE TEST 1 −80 − CASE TEMPERATURE Tc (°C) CAPACITANCE – 10000 1000 ...

Page 5

Duty=0.5 0.2 0.1 0.1 0.05 0.02 SINGLE PULSE 0.01 0.01 0.001 10μ 100μ SAFE OPERATING AREA 100 I D max (PULSED) * 100 μ max (CONTINUOUS OPERATION 1 Tc ...

Page 6

RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and ...

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