2SC5509-T2 NEC [NEC], 2SC5509-T2 Datasheet - Page 13

• Manufacturer Part Number: 2SC5509-T2
• Description: NPN SILICON RF TRANSISTOR
• Manufacturer: NEC [NEC]

RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
MOUNTING TECHNOLOGY MANUAL (C10535E: published by NEC Corporation).
Infrared Reflow
VPS
Wave Soldering
Note After opening the dry pack, store it at 25 C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
This product should be soldered and mounted under the following recommended conditions.
For the details the recommended soldering conditions, refer to the document SEMICONDUCTOR DEVICE
Soldering Method
Package peak temperature: 235 C or below,
Time: 30 seconds or less (at 210 C or higher),
Count: 2 times or less, Exposure limit: None
Package peak temperature: 215 C or below,
Time: 40 seconds or less (at 200 C or higher),
Count: 2 times or less, Exposure limit: None
Soldering bath temperature: 260 C or below,
Time: 10 seconds or less,
Count: 1 time, Exposure limit: None
Data Sheet PU10009EJ01V0DS
Soldering Conditions
Note
Note
Note
Recommended Condition Symbol
WS60-00-1
VP15-00-2
IR30-00-2
For soldering
2SC5509
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