EP7309-CB-C CIRRUS [Cirrus Logic], EP7309-CB-C Datasheet - Page 31

• Manufacturer Part Number: EP7309-CB-C
• Description: HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
• Manufacturer: CIRRUS [Cirrus Logic]

256-Ball PBGA Package Characteristics
256-Ball PBGA Package Specifications
DS507PP1
Die Pad
Note:
Table T. 204-Ball TFBGA Ball List (Continued)
1) For pin locations see
2) Dimensions are in millimeters (inches), and controlling dimension is millimeter
3) Before beginning any new EP7309 design, contact Cirrus Logic for the latest package information.
Bond Pad Package Ball
Y1
Y2
Y3
Table

Copyright 2001 Cirrus Logic (All Rights Reserved)
U.
Figure 13. 256-Ball PBGA Package
Signal
GNDR
GNDR
GNDR
High-Performance, Low-Power System on Chip
EP7309
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