EP7309-CB-C CIRRUS [Cirrus Logic], EP7309-CB-C Datasheet - Page 21

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EP7309-CB-C

Manufacturer Part Number
EP7309-CB-C
Description
HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE
Manufacturer
CIRRUS [Cirrus Logic]
Datasheet
Packages
208-Pin LQFP Package Characteristics
208-Pin LQFP Package Specifications
DS507PP1
Note:
1) Dimensions are in millimeters (inches), and controlling dimension is millimeter.
2) Drawing above does not reflect exact package pin count.
3) Before beginning any new design with this device, please contact Cirrus Logic for the latest package information.
4) For pin locations, please see
29.60 (1.165)
30.40 (1.197)
0.09 (0.004)
0.20 (0.008)
(0.0197)
BSC
0.50
Pin 208
1.40 (0.055)
1.60 (0.063)
Pin 1
Copyright 2001 Cirrus Logic (All Rights Reserved)
Figure 10. 208-Pin LQFP Package Outline Drawing
0.45 (0.018)
0.75 (0.030)
Figure
Pin 1 Indicator
11. For pin descriptions see the EP7309 User’s Manual.
208-Pin LQFP
EP7309
29.60 (1.165)
30.40 (1.197)
27.80 (1.094)
28.20 (1.110)
0.17 (0.007)
0.27 (0.011)
1.35 (0.053)
1.45 (0.057)
High-Performance, Low-Power System on Chip
0.05 (0.002)
0.15 (0.006)
1.00 (0.039) BSC
27.80 (1.094)
28.20 (1.110)
0° MIN
7° MAX
EP7309
21

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