MCF52223 FREESCALE [Freescale Semiconductor, Inc], MCF52223 Datasheet - Page 31

• Manufacturer Part Number: MCF52223
• Description: Microcontroller Data Sheet
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Freescale Semiconductor
NOTES:
1
2
3
4
5
6
The average chip-junction temperature (T
Where:
For most applications P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P
for a known T
any value of T
64 QFN
θ
recommends the use of θ
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the Ψ
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
JA
and Ψ
T
Θ
P
P
P
A
D
INT
I/O
JA
jt
A
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
A
. Using this value of K, the values of P
.
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case (bottom)
Junction to top of package
Maximum operating junction temperature
= Ambient Temperature, °C
= Package Thermal Resistance, Junction-to-Ambient, °C/W
= P
= I
= Power Dissipation on Input and Output Pins — User Determined
I/O
DD
INT
< P
× V
JA
+ P
INT
K = P
and power dissipation specifications in the system design to prevent device junction
DD
MCF52223 ColdFire® Microcontroller Data Sheet, Rev. 1
I/O
and can be ignored. An approximate relationship between P
, Watts - Chip Internal Power
Table 20. Thermal Characteristics (continued)
D
× (T
J
A
) in °C can be obtained from:
Characteristic
+ 273 °C) + Θ
P
T
D
J
=
=
K
T
A
D
÷
+
and T
(
Preliminary
T
(
P
J
JMA
+
D
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
J
273°C
×
can be obtained by solving equations (1) and (2) iteratively for
× P
Θ
JMA
D
)
2
)
(1)
(2)
(3)
Preliminary Electrical Characteristics
Symbol
θ
θ
θ
θ
θ
θ
Ψ
JMA
JMA
D
T
JA
JA
JB
JC
jt
j
and T
J
(if P
Value
68
24
55
19
0.6
105
I/O
8
3
D
1,2
1,3
1,3
1,3
4
6
5
is neglected) is:
(at equilibrium)
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
jt
Unit
o
C
31