LPC2364_10 NXP [NXP Semiconductors], LPC2364_10 Datasheet - Page 53
![no-image](/images/no-image-200.jpg)
LPC2364_10
Manufacturer Part Number
LPC2364_10
Description
Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.LPC2364_10.pdf
(59 pages)
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NXP Semiconductors
Fig 20. Package outline SOT926-1 (TFBGA100)
LPC2364_65_66_67_68_6
Product data sheet
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT926-1
VERSION
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
G
K
H
D
C
B
A
F
E
J
0.65
0.8
A
2
1
IEC
- - -
2
0.5
0.4
b
e
3
9.1
8.9
4
D
5
e
D
1
9.1
8.9
JEDEC
6
E
- - -
1/2 e
7
REFERENCES
0.8
e
8
Rev. 06 — 1 February 2010
b
9
0
7.2
e
10
1
JEITA
7.2
e
- - -
2
1/2 e
scale
B
e
2.5
∅ v
∅ w
0.15
v
M
M
e
A
E
2
C
C
0.05
A
w
5 mm
A
B
0.08
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
A
y
1
A
2
0.1
y
1
y
1
C
detail X
PROJECTION
EUROPEAN
X
C
y
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
05-12-09
05-12-22
SOT926-1
53 of 59
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