P89LPC920FDH PHILIPS [NXP Semiconductors], P89LPC920FDH Datasheet - Page 43

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P89LPC920FDH

Manufacturer Part Number
P89LPC920FDH
Description
8-bit microcontrollers with two-clock 80C51 core 2 kB/4 kB/8 kB 3 V low-power Flash with 256-byte data RAM
Manufacturer
PHILIPS [NXP Semiconductors]

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
P89LPC920FDH
Manufacturer:
FSC
Quantity:
5
Philips Semiconductors
15. Revision history
Table 13:
9397 750 11945
Product data
Rev Date
04
03
02
01
20030909
20030811
20030522
20030505
Revision history
CPCN
-
-
-
-
[3]
[4]
[5]
[6]
[7]
[8]
Description
Product data (9397 750 11945); ECN 853-2403 30305 of 5 September 2003
Modifications:
Preliminary data (9397 750 11786)
Objective data (9397 750 11532)
Preliminary data (9397 750 11387)
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Add P89LPC920 device.
Adjust
Section “Boot ROM” on page
Add new
Section 8.24.2
Section “In-Circuit Programming (ICP)” on page
Rev. 04 — 09 September 2003
features list.
32; adjust last line.
8-bit microcontrollers with two-clock 80C51 core
P89LPC920/921/922
10 C measured in the atmosphere of the reflow
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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