P89LPC920FDH PHILIPS [NXP Semiconductors], P89LPC920FDH Datasheet - Page 43

• Manufacturer Part Number: P89LPC920FDH
• Description: 8-bit microcontrollers with two-clock 80C51 core 2 kB/4 kB/8 kB 3 V low-power Flash with 256-byte data RAM
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
15. Revision history
Table 13:
9397 750 12285
Product data
Rev Date
06
05
04
03
02
01
20031121
20031007
20030909
20030811
20030522
20030505
Revision history
CPCN
-
-
-
-
-
-
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Description
Product data (9397 750 12285); ECN 853-2403 01-A14557 of 18 November 2003
Modification:
Product data (9397 750 12121); ECN 853-2403 30391 of 30 September 2003
Product data (9397 750 11945); ECN 853-2403 30305 of 5 September 2003
Preliminary data (9397 750 11786)
Objective data (9397 750 11532)
Preliminary data (9397 750 11387)
•
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Table 8 “DC electrical characteristics” on page
1.5 V to 2.0 V
Rev. 06 — 21 November 2003
8-bit microcontrollers with two-clock 80C51 core
P89LPC920/921/922
35: I
10 C measured in the atmosphere of the reflow
TL
V
IN
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
conditions, changed value from
43 of 45