FLC087XP EUDYNA [Eudyna Devices Inc], FLC087XP Datasheet

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FLC087XP

Manufacturer Part Number
FLC087XP
Description
GaAs FET & HEMT Chips
Manufacturer
EUDYNA [Eudyna Devices Inc]
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
FLC087XP
Manufacturer:
TST
Quantity:
5 000
Edition 1.3
July 1999
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25°C)
Fujitsu recommends the following conditions for the reliable operation of GaAs FETs:
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25°C)
Note: RF parameter sample size 10pcs. criteria (accept/reject)=(2/3)
FEATURES
• High Output Power: P 1dB = 28.5dBm(Typ.)
• High Gain: G 1dB = 7.0dB(Typ.)
• High PAE: η add = 31.5%(Typ.)
• Proven Reliability
DESCRIPTION
The FLC087XP chip is a power GaAs FET that is designed for general
purpose applications in the C-Band frequency range as it provides
superior power, gain, and efficiency.
Fujitsu’s stringent Quality Assurance Program assures the
highest reliability and consistent performance.
Thermal Resistance
Drain-Source Voltage
Gate-Source Voltage
Total Power Dissipation
Storage Temperature
Channel Temperature
Saturated Drain Current
Transconductance
Pinch-off Voltage
Gate Source Breakdown Voltage
Output Power at 1dB
Gain Compression Point
Power Gain at 1dB
Gain Compression Point
Power-added Efficiency
The chip must be enclosed in a hermetically sealed environment for optimum performance and reliability.
1. The drain-source operating voltage (V DS ) should not exceed 10 volts.
2. The forward and reverse gate currents should not exceed 4.8 and -0.5 mA respectively with
3. The operating channel temperature (T ch ) should not exceed 145°C.
gate resistance of 400Ω.
Item
Item
Symbol
V GSO
G 1dB
I DSS
P 1dB
η add
R th
Symbol
g m
V p
V GS
V DS
T stg
P tot
T ch
Channel to Case
V DS = 5V, V GS = 0V
V DS = 5V, I DS = 200mA
V DS = 5V, I DS = 15mA
I GS = -15µA
V DS = 10V
I DS ≈ 0.6I DSS
f = 8GHz
Test Conditions
1
T c = 25°C
Condition
GaAs FET & HEMT Chips
Min.
27.5
-1.0
6.0
75
-5
-
-
-
-65 to +175
Rating
4.16
Limit
28.5
31.5
Typ.
-2.0
175
300
150
7.0
25
15
-5
-
FLC087XP
Source
Max.
450
-3.5
36
-
-
-
-
-
Gate
Drain
Source
°C/W
dBm
Unit
Unit
mA
mS
dB
°C
°C
W
%
V
V
V
V

Related parts for FLC087XP

FLC087XP Summary of contents

Page 1

... High PAE: η add = 31.5%(Typ.) • Proven Reliability DESCRIPTION The FLC087XP chip is a power GaAs FET that is designed for general purpose applications in the C-Band frequency range as it provides superior power, gain, and efficiency. Fujitsu’s stringent Quality Assurance Program assures the highest reliability and consistent performance. ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25° ...

Page 2

... FLC087XP GaAs FET & HEMT Chips POWER DERATING CURVE 100 150 Case Temperature (°C) OUTPUT POWER vs. INPUT POWER =10V f=4GHz I DS ≈0.6I DSS 28 P out 26 24 f=4GHz 22 20 η add Input Power (dBm) DRAIN CURRENT vs ...

Page 3

... Download S-Parameters, click here 3 FLC087XP S22 MAG ANG .510 -4.7 .467 -21.1 .399 -34.2 .355 -42.2 .332 -48.2 .323 -53.7 .320 -59.0 .323 -64.3 .330 -69.7 .338 -74.9 .349 -80.2 .362 -85.3 .375 -90.4 .390 -95.3 .406 -100.2 .422 -105 ...

Page 4

... FLC087XP GaAs FET & HEMT Chips For further information please contact: FUJITSU COMPOUND SEMICONDUCTOR, INC. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. Phone: (408) 232-9500 FAX: (408) 428-9111 www.fcsi.fujitsu.com FUJITSU MICROELECTRONICS, LTD. Compound Semiconductor Division Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ ...

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