STTS424E02BDA3E STMICROELECTRONICS [STMicroelectronics], STTS424E02BDA3E Datasheet - Page 48

• Manufacturer Part Number: STTS424E02BDA3E
• Description: Memory module temperature sensor with a 2 Kb SPD EEPROM
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Landing pattern
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Landing pattern
The landing pattern recommendations per the JEDEC proposal for the TDFN package (DN)
are shown in
The preferred implementation with wide corner pads enhances device centering during
assembly, but a narrower option is defined for modules with tight routing requirements.
Figure 19. Landing pattern - TDFN package (DN)
Figure
E3
E3
19.
L
K
L
K
b4
b2
e4
K2
e2
D2/2
e/2
e
b
D2
K2
b
e/2
D2/2
K2
E2/2
E2/2
E2
STTS424E02
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