SE98 NXP [NXP Semiconductors], SE98 Datasheet - Page 23

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SE98

Manufacturer Part Number
SE98
Description
DDR memory module temp sensor, 3.3 V
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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NXP Semiconductors
SE98_4
Product data sheet
8.6 Temperature register (16-bit read-only)
8.7 Manufacturer’s ID register (16-bit read-only)
Table 18.
Table 19.
The manufacture’s ID matches that assigned to NXP Semiconductors PCI-SIG (1131h),
and is intended for use to identify the manufacturer of the device.
Table 20.
Bit
Symbol
Reset
Access
Bit
15
14
13
12
11:1
0
Bit
Symbol
Reset
Access
Bit
Symbol
Reset
Access
Bit
Symbol
Reset
Access
Symbol
ACT
AAW
BAW
SIGN
TEMP
RFU
Temperature register bit allocation
Temperature register bit description
Manufacturer’s ID register bit allocation
ACT
15
15
R
R
0
0
R
R
7
0
7
0
Description
Above Critical Trip.
Above Alarm Window.
Below Alarm Window.
Sign bit.
Temperature Value (2’s complement). (LSB = 0.125 C)
reserved; always 0
Rev. 04 — 2 February 2009
AAW
14
14
R
R
0 — temperature is below the Critical Alarm Trip register setting
1 — temperature is equal to or above the Critical Alarm Trip register
setting
0 — temperature is equal to or below the Upper Boundary Alarm Trip
register
1 — temperature is above the Alarm window
0 — temperature is equal to or above the Lower Boundary Alarm Trip
register
1 — temperature is below the Alarm window
0 — positive temperature value
1 — negative temperature value
0
R
0
R
6
0
6
0
BAW
13
13
R
R
0
0
R
R
5
0
5
1
TEMP[6:0]
SIGN
Manufacturer ID
12
12
R
R
0
R
1
R
4
0
4
1
(continued)
DDR memory module temp sensor, 3.3 V
11
11
R
R
0
0
R
R
3
0
3
0
10
10
R
R
0
R
0
R
TEMP[10:7]
2
0
2
0
© NXP B.V. 2009. All rights reserved.
R
R
9
0
R
9
0
R
1
0
1
0
SE98
RFU
23 of 39
R
R
8
0
8
1
R
R
0
0
0
1

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