TC72-2.8MMF MICROCHIP [Microchip Technology], TC72-2.8MMF Datasheet - Page 18

• Manufacturer Part Number: TC72-2.8MMF
• Manufacturer: MICROCHIP [Microchip Technology]

TC72
8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)
DS21743A-page 18
Z
Terminal Pitch
Terminal Land Pattern O.D.
Terminal Land Pattern I.D.
Exposed Pad Clearance
Interior Lead Clearance
Terminal Land Width
Terminal Land Length
Exposed Pad Length
Optional Exposed Pad Length
Exposed Pad Width
Termal Via Pitch
Thermal Via Diameter
Minimum Solder Mask Clearance
Drawing No. C04-2062
*Controlling Parameter
Notes:
1.
G
Exposed pad dimensions vary with paddle size.
CP
OPTIONAL TWO LAYER
DFN LAND PATTERN
PCB LAND PATTERN
X
Dimension Limits
H2
H
p
Units
CP
A1
H2
G2
P1
M
Z
Z
X
Y
H
V
p
G2
Y
MIN
.134
.057
.006
.071
.014
.033
.130
.130
.057
.002
M (TYP)
INCHES
.026 BSC
NOM
.047
.012
THERMAL VIAS
ON 4 LAYER
PC BOARD
MAX
TYPCAL SOLDER MASKS
.157
.060
.017
.035
.059
0V
OPTIONAL FOUR LAYER
P1
PCB LAND PATTERN
MIN
3.40
1.45
0.15
1.80
0.35
0.85
3.30
3.30
1.45
0.05
MILLIMETERS*
2002 Microchip Technology Inc.
0.65 BSC
NOM
1.20
0.30
MAX
4.00
1.53
0.42
0.88
1.50