TPS850_07 TOSHIBA [Toshiba Semiconductor], TPS850_07 Datasheet - Page 5
TPS850_07
Manufacturer Part Number
TPS850_07
Description
Photo-IC Silicon Epitaxial Planar
Manufacturer
TOSHIBA [Toshiba Semiconductor]
Datasheet
1.TPS850_07.pdf
(10 pages)
Packing Specification
(2)
(3)
(1)
(2)
Recommended soldering pattern
Cleaning conditions
Packing quantity
Packing format
•
When cleaning is required after soldering
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
Carton specification
Chemicals: AK225 alcohol
Temperature and time: 50°C × 30 s or : 30°C × 3 minutes
Ultrasonic cleaning: 300 W or less
Carton dimensions
Reel (minimum packing quantity)
(W) 81 mm × (L) 280 mm × (H) 280 mm
Carton
1.6
1.3
5
5 reels (15000 devices)
Label
1.6
3000 devices
Unit: mm
2007-10-01
TPS850