MC35XS3400 FREESCALE [Freescale Semiconductor, Inc], MC35XS3400 Datasheet - Page 5

• Manufacturer Part Number: MC35XS3400
• Description: Quad High Side Switch (Quad 35m?)
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Table 2. Maximum Ratings
permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL RATINGS
THERMAL RATINGS
THERMAL RESISTANCE
Notes
V
V
Input / Output Voltage
WAKE Input Clamp Current
CSNS Input Clamp Current
HS [0:3] Voltage
Output Current
Output Clamp Energy using single-pulse method
ESD Voltage
Operating Temperature
Storage Temperature
Thermal Resistance
Peak Pin Reflow Temperature During Solder Mounting
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
PWR
DD
1.
2.
3.
4.
5.
6.
Load Dump at 25°C (400ms)
Maximum Operating Voltage
Reverse Battery at 25°C (2 min.)
Positive
Negative
Human Body Model (HBM) for HS[0:3], VPWR and GND
Human Body Model (HBM) for other pins
Charge Device Model (CDM)
Ambient
Junction
Junction to Case
Junction to Ambient
Supply Voltage Range
Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
Active clamp energy using single-pulse method (L = 2mH, R
ESD testing is performed in accordance with the Human Body Model (HBM) (C
(C
Input / Output pins are: IN[0:3], RST, FSI, CSNS, SI, SCLK, CS, SO, FS
Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of R
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause a malfunction or permanent damage to the device.
Supply Voltage Range
Corner Pins (1, 13, 19, 21)
All Other Pins (2-12, 14-18, 20, 22-24)
ZAP
(3)
= 200pF, R
(1)
(5)
ZAP
= 0Ω), and the Charge Device Model (CDM), Robotic (C
Ratings
ELECTRICAL CHARACTERISTICS
(2)
(6)
MAXIMUM RATINGS
L
= 0Ω, V
PWR
θJA
= 14V, T
can be reached in a real application case (4 layers board).
I
V
I
ZAP
T
ZAP
CL(WAKE)
CL(CSNS)
Symbol
V
E
I
PWR(SS)
V
V
V
V
SOLDER
HS[0:3]
T
HS[0:3]
CL [0:3]
R
R
V
ESD1
ESD2
ESD3
ESD4
T
T
STG
(4)
= 4.0pF).
θ
θ
DD
= 100pF, R
A
J
JC
JA
J
= 150
°
C initial).
ZAP
-0.3 to V
= 1500Ω), the Machine Model (MM)
ELECTRICAL CHARACTERISTICS
-0.3 to 5.5
- 40 to 125
- 40 to 150
- 55 to 150
± 8000
± 2000
Value
± 750
± 500
<1.0
245
-18
-16
2.5
2.5
41
28
41
35
30
6
DD
+ 0.3
MAXIMUM RATINGS
°
Unit
35XS3400
mA
mA
C/ W
mJ
°
°
°
V
V
V
V
A
V
C
C
C
5