UBA20271T PHILIPS [NXP Semiconductors], UBA20271T Datasheet
UBA20271T
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UBA20271T Summary of contents
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UBA20271/2 350 V and 600 V Power ICs for dimmable compact fluorescent lamps Rev. 2.1 — 12 October 2011 1. General description The UBA20271/2 are high-voltage power ICs intended to drive and control higher powered self ballasted Compact Fluorescent Lamp ...
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... Dimmable compact fluorescent lamps for power levels from directly operating from 230 V (UBA20272) and 120 V (UBA20271) mains voltage. 4. Ordering information Table 1. Ordering information Type number Package Name UBA20271T/N1 SO20 UBA20272T/N1 SO20 UBA20271_UBA20272 Product data sheet 350 V and 600 V Power ICs for dimmable compact fluorescent lamps Description Plastic small outline package ...
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SUPPLY REFERENCE VOLTAGES 5 V DIGITAL 5 V ANALOG V DD(stop) RESET 13 CP PREHEAT BOOST TIMER μA 6 μA 60 μA 15 SGND REFERENCE VOLTAGE CONTROLLED OSCILLATOR CURRENT 1. ...
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NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. 6.2 Pin description Table 2. Symbol SLS LSAT PGND V DD RREF CF MDL CI CSI DCI CP CB SGND FS HBO DHS [1] SLS pins are internally connected [2] HBO ...
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NXP Semiconductors 7. Functional description The UBA20271/2 are ICs with integrated half-bridge MOSFETs in self ballasted high-power CFL and their derivatives. The UBA20271/2 are equipped with variable dimming functionality that has a logarithmic corrected natural dimming function. This function enables ...
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NXP Semiconductors 7.1 Lamp start-up cycle 7.1.1 Reset state The UBA20271/2 are in a reset state while the supply voltage on the V the V DD(rst) counters and timers are undefined. In addition, the hold state latch is reset and ...
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NXP Semiconductors The preheat time consists of eight saw-toothed pulses at the CP pin. Preheat begins as soon as the capacitor on the CP pin is charged to a voltage higher than V the preheat time, the current feedback sensor ...
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NXP Semiconductors voltage ( th(CP)max V th(CP)min V th(rel)CP st startup 1 preheat time time Fig 5. Retry cycle 7.1.5 Boost state and transition to burn state When ignition is detected by measuring ...
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NXP Semiconductors V th(CP)max V th(CP)min V th(CB)max V th(CB)min 0.6 V Fig 6. In the boost state, the lamp current feedback control circuit operates the same as in the burn state. This action is used to improve lamp stability. ...
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NXP Semiconductors internal current output of the OTA is transferred via an integrator on the CI pin to the input of the Voltage Controlled Oscillator (VCO). The VCO regulates the frequency and as a result, the lamp current. 00 burn ...
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NXP Semiconductors When CP is lower than V start-up state. See lower than V With a 470 nF capacitor on the CP pin, the typical hold state retention delay is between 1.0 seconds and 1.7 seconds. However, it depends on ...
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NXP Semiconductors Fig 8. 7.2.2 Combined timing circuit A combined timing circuit is included to determine the preheat time, ignition enabling time and overcurrent time, see C and R CP The timing circuit starts operating following the start-up state, as ...
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NXP Semiconductors voltage ( th(CP)max 4 3.8 V th(CP)min startup time 0 V Fig 9. Timing diagram preheat, ignition and overcurrent 7.3 Natural linear dimming What determines the actual internal set point level used for ...
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NXP Semiconductors V i(CSI RMS midcurve (1) V Fig 10. CSI voltage as a function of DCI voltage 7.4 Protection and power-down 7.4.1 Coil saturation protection Coil saturation protection is integrated into the IC to allow for the ...
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NXP Semiconductors and external resistor R threshold level V level is internally clamped at 2 reasons even when R 7.4.2 OverCurrent Protection (OCP) OCP is active in the burn and boost states (not during boost transition). When the ...
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NXP Semiconductors 7.4.5 Power-down mode Power-down mode starts when: • a continuous overcurrent exceeds the maximum overcurrent time-out t a longer period when an overcurrent occurs in more than half the number of cycles V th(CP)min • during the boost ...
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NXP Semiconductors 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter General R external resistance on pin RREF ext(RREF) SR slew rate T ambient temperature amb T junction temperature j ...
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NXP Semiconductors Table 3. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V voltage on pin voltage on pin MDL MDL ESD V electrostatic discharge voltage ESD Latch-up [1] In ...
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NXP Semiconductors Table 5. Characteristics …continued HBO amb positive currents flow into the IC, unless otherwise specified. Symbol Parameter High-voltage supply (DHS, HBO and FS) I leakage ...
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NXP Semiconductors Table 5. Characteristics …continued HBO amb positive currents flow into the IC, unless otherwise specified. Symbol Parameter R /R on-state resistance on(150) on(25) ratio (150 ...
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NXP Semiconductors Table 5. Characteristics …continued HBO amb positive currents flow into the IC, unless otherwise specified. Symbol Parameter V minimum threshold th(CB)min voltage on pin CB ...
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NXP Semiconductors Table 5. Characteristics …continued HBO amb positive currents flow into the IC, unless otherwise specified. Symbol Parameter Ignition current detection Input: pin CSI V ignition ...
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NXP Semiconductors Table 5. Characteristics …continued HBO amb positive currents flow into the IC, unless otherwise specified. Symbol Parameter V start threshold voltage th(start)DCI on pin DCI ...
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NXP Semiconductors 11. Application information 11.1 Design equations All equations are only valid for R 11.1.1 C related timing equations: CP • Preheat time: ------------- - • Ignition enabling time: t en ign • ...
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NXP Semiconductors f bridge min • Minimum bridge frequency with enabled boost f bridge bst Where: C 11.1.4 R related preheat current: SLS I 11.1.5 R related MDL: MDL • MDL threshold voltage MDL ...
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NXP Semiconductors Table 6. Reference Component R1 R2 R5, R6 R7, R10 R8 R9 R11 R REF R SLS R MDL R CSI R LSAT C1 C6, C14 C10 C11 C12 ...
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NXP Semiconductors Table 6. Reference Component UBA20271_UBA20272 Product data sheet 350 V and 600 V Power ICs for dimmable compact fluorescent lamps Typical components for a 230 V mains application UBA20271 UBA20272 4.7 mH 4.7 mH 1000/4/4 ...
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NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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NXP Semiconductors 13. Abbreviations Table 7. Acronym CFL CMP DSR ESD HS LS MDL OCP OPP OTA OTP RMS SR UVLO VCO UBA20271_UBA20272 Product data sheet 350 V and 600 V Power ICs for dimmable compact fluorescent lamps Abbreviations Description ...
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NXP Semiconductors 14. Revision history Table 8. Revision history Document ID Release date UBA20271_UBA20272 v.2.1 20111012 Modifications: UBA20271_UBA20272 v.2 20110816 UBA20271_UBA20272 v.1 20110816 UBA20271_UBA20272 Product data sheet 350 V and 600 V Power ICs for dimmable compact fluorescent lamps Data ...
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NXP Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use neither qualified nor tested in accordance with automotive testing ...
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NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...