UBA2021_08 PHILIPS [NXP Semiconductors], UBA2021_08 Datasheet

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UBA2021_08

Manufacturer Part Number
UBA2021_08
Description
630 V driver IC for CFL and TL lamps
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
1. General description
2. Features
3. Quick reference data
The UBA2021 is a high voltage IC intended to drive and control Compact Fluorescent
Lamps (CFL) or fluorescent TL lamps. It contains a driver circuit for an external
half-bridge, an oscillator and a control circuit for starting up, preheating, ignition, lamp
burning and protection.
I
I
I
I
I
I
I
I
Table 1.
Symbol
High voltage supply
V
Start-up state
V
V
I
Preheat mode
f
t
V
Frequency sweep to ignition
f
t
Normal operation
f
t
VS(standby)
start
ph
B
ign
B
no
FS
VS(start)
VS(stop)
RS(ctrl)
UBA2021
630 V driver IC for CFL and TL lamps
Rev. 04 — 25 July 2008
Adjustable preheat and ignition time.
Adjustable preheat current.
Adjustable lamp power.
Lamp power independent from mains voltage variations.
Overpower protection.
Lamp temperature stress protection at higher mains voltages.
Capacitive mode protection.
Protection against a drive voltage that is too low for the power MOSFETs.
Quick reference data
Parameter
high side supply voltage
oscillator start voltage
oscillator stop voltage
standby current
start frequency
preheat time
control voltage at pin RS
bottom frequency
ignition time
bottom frequency
non-overlap time
Conditions
I
V
C
FS
VS
CP
< 15 A; t < 0.5 s
= 11 V
= 100 nF
Min
-
-
-
-
-
-
-
-
-
-
-
Product data sheet
Typ
-
11.95
10.15
200
108
666
42.9
625
42.9
1.4
600
Max
630
-
-
-
-
-
-
-
-
-
-
Unit
V
V
V
kHz
ms
mV
kHz
ms
kHz
A
s

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UBA2021_08 Summary of contents

Page 1

UBA2021 630 V driver IC for CFL and TL lamps Rev. 04 — 25 July 2008 1. General description The UBA2021 is a high voltage IC intended to drive and control Compact Fluorescent Lamps (CFL) or fluorescent TL lamps. It ...

Page 2

NXP Semiconductors Table 1. Symbol I tot R , G1(on) R G2(on G1(off) R G2(off) Feed-forward i(RHV) 4. Ordering information Table 2. Ordering information Type number Package Name UBA2021T SO14 UBA2021P DIP14 5. Block diagram ...

Page 3

NXP Semiconductors 6. Pinning information 6.1 Pinning UBA2021T 4 n. PGND 001aai566 Fig 2. Pin configuration (SO14) 6.2 Pin description Table 3. Symbol n. ...

Page 4

NXP Semiconductors 7.2 Initial start-up Initial start-up is achieved by charging capacitor CS9 with the current applied to the RHV-pin. At start-up, MOSFET T2 conducts and T1 does not conduct. This ensures C becomes charged. This start-up state is reached ...

Page 5

NXP Semiconductors Fig 5. 7.5 Ignition state The RS monitoring function changes from V protection at the end of the preheat time. Normally this results in a further frequency decrease down to the bottom frequency f frequency in the ignition ...

Page 6

NXP Semiconductors V , the ripple is filtered out. The capacitor connected to the CP-pin is used for this in purpose. This pin is also used in the preheat state and the ignition state for timing ( ign ...

Page 7

NXP Semiconductors 7.12 Frequency and change in frequency At any point in time during oscillation, the circuit will operate between f change in frequency will be gradual, no steps in frequency will occur. Changes in frequency caused by a change ...

Page 8

NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to ground. Symbol T stg Q couple V es [1] HBM: 2000 V, except pins FS, G1, S1 and VS which are 1000 ...

Page 9

NXP Semiconductors Table 7. Characteristics …continued amb Symbol Parameter I clamp current VS(clamp) Preheat mode f starting frequency start t conducting time T1 and T2 g ...

Page 10

NXP Semiconductors Table 7. Characteristics …continued amb Symbol Parameter f feed-forward frequency ff SYM symmetry ff RR ripple rejection R CP switch series resistance CP(sw) R ...

Page 11

NXP Semiconductors • Where: • bottom frequency. B • feed-forward frequency. ff • frequency due to capacitive mode detection. cm • Preheat time: • Ignition time: • Non-overlap time: 12. Application information DS1 DS2 ...

Page 12

NXP Semiconductors 13. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 13

NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...

Page 14

NXP Semiconductors 14. Revision history Table 8. Revision history Document ID Release date UBA2021_4 20080725 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have ...

Page 15

NXP Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

Page 16

NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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