UBA2021_08 PHILIPS [NXP Semiconductors], UBA2021_08 Datasheet
UBA2021_08
Related parts for UBA2021_08
UBA2021_08 Summary of contents
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UBA2021 630 V driver IC for CFL and TL lamps Rev. 04 — 25 July 2008 1. General description The UBA2021 is a high voltage IC intended to drive and control Compact Fluorescent Lamps (CFL) or fluorescent TL lamps. It ...
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NXP Semiconductors Table 1. Symbol I tot R , G1(on) R G2(on G1(off) R G2(off) Feed-forward i(RHV) 4. Ordering information Table 2. Ordering information Type number Package Name UBA2021T SO14 UBA2021P DIP14 5. Block diagram ...
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NXP Semiconductors 6. Pinning information 6.1 Pinning UBA2021T 4 n. PGND 001aai566 Fig 2. Pin configuration (SO14) 6.2 Pin description Table 3. Symbol n. ...
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NXP Semiconductors 7.2 Initial start-up Initial start-up is achieved by charging capacitor CS9 with the current applied to the RHV-pin. At start-up, MOSFET T2 conducts and T1 does not conduct. This ensures C becomes charged. This start-up state is reached ...
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NXP Semiconductors Fig 5. 7.5 Ignition state The RS monitoring function changes from V protection at the end of the preheat time. Normally this results in a further frequency decrease down to the bottom frequency f frequency in the ignition ...
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NXP Semiconductors V , the ripple is filtered out. The capacitor connected to the CP-pin is used for this in purpose. This pin is also used in the preheat state and the ignition state for timing ( ign ...
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NXP Semiconductors 7.12 Frequency and change in frequency At any point in time during oscillation, the circuit will operate between f change in frequency will be gradual, no steps in frequency will occur. Changes in frequency caused by a change ...
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NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to ground. Symbol T stg Q couple V es [1] HBM: 2000 V, except pins FS, G1, S1 and VS which are 1000 ...
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NXP Semiconductors Table 7. Characteristics …continued amb Symbol Parameter I clamp current VS(clamp) Preheat mode f starting frequency start t conducting time T1 and T2 g ...
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NXP Semiconductors Table 7. Characteristics …continued amb Symbol Parameter f feed-forward frequency ff SYM symmetry ff RR ripple rejection R CP switch series resistance CP(sw) R ...
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NXP Semiconductors • Where: • bottom frequency. B • feed-forward frequency. ff • frequency due to capacitive mode detection. cm • Preheat time: • Ignition time: • Non-overlap time: 12. Application information DS1 DS2 ...
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NXP Semiconductors 13. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...
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NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...
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NXP Semiconductors 14. Revision history Table 8. Revision history Document ID Release date UBA2021_4 20080725 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have ...
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NXP Semiconductors 15. Legal information 15.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...