TZA3030HL PHILIPS [NXP Semiconductors], TZA3030HL Datasheet - Page 6

• Manufacturer Part Number: TZA3030HL
• Description: SDH/SONET STM1/OC3 optical receiver
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
1998 Aug 24
AGND
V
AGND
DREF
V
AGND
IPhoto
AGND
AGND
BWC
V
SUB
DGND
RFTEST
OUTSEL
DGND
V
OUTCML
handbook, full pagewidth
CCA
CCA
ref
CCD
SDH/SONET STM1/OC3 optical receiver
SYMBOL
PAD
10
12
13
14
15
16
17
18
11
1
2
3
4
5
6
7
8
9
1.58
mm
x
1100
1257
1398
1398
COORDINATES
102
102
102
102
102
102
102
102
243
383
523
663
803
943
AGND
AGND
AGND
IPhoto
AGND
V CCA
V CCA
x
DREF
Fig.3 Bonding pad locations of TZA3030U.
0
0
y
1
2
3
4
5
6
7
8
32
9
1251
1111
971
814
674
534
395
254
105
105
105
105
105
105
105
105
263
403
31
10
y
(1)
30
11
TZA3030U
12
29
6
1.58 mm
13
Note
1. All coordinates ( m) are measured with respect to the
28
OUTQCML
V
DGND
OUTPECL
OUTQPECL
DGND
DGND
LOS
LOSQ
LOSTTL
LOSTH
AGND
AGC
AGND
CCD
14
bottom left-hand corner of the die.
SYMBOL
27
15
26
16
25
24
23
22
20
19
18
17
21
PAD
DGND
OUTQPECL
OUTPECL
DGND
V CCD
OUTQCML
OUTCML
V CCD
19
20
21
22
23
24
25
26
27
28
29
30
31
32
MBK858
COORDINATES
1398
1398
1398
1398
1398
1398
1283
1143
986
829
671
514
357
217
Objective specification
x
TZA3030
1103
1243
1400
1400
1400
1400
1400
1400
1400
1400
543
683
823
963
y
(1)