MCP1406-E/PA MICROCHIP [Microchip Technology], MCP1406-E/PA Datasheet - Page 16

• Manufacturer Part Number: MCP1406-E/PA
• Description: 6A High-Speed Power MOSFET Drivers
• Manufacturer: MICROCHIP [Microchip Technology]

MCP1406/07
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
DS22019A-page 16
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
p
n
45°
β
Dimension Limits
§
E1
E
Units
A2
E1
A1
A
E
D
B
n
p
h
L
φ
c
α
β
MIN
h
.053
.052
.004
.228
.146
.189
.010
.019
.008
.013
2
1
0
0
0
L
D
φ
INCHES*
NOM
8
.050
.056
.007
.237
.154
.193
.015
.025
.009
.017
.061
12
12
4
A
A1
MAX
.069
.010
.244
.157
.197
.020
.030
.010
.020
.061
15
15
8
MIN
1.35
0.25
1.32
0.10
5.79
4.80
0.48
0.20
0.33
3.71
0
0
0
MILLIMETERS
NOM
8
© 2006 Microchip Technology Inc.
1.27
1.55
1.42
0.18
6.02
4.90
0.38
0.62
0.23
0.42
3.91
12
12
α
4
MAX
A2
1.75
1.55
0.25
6.20
3.99
5.00
0.76
0.25
0.51
0.51
15
15
8