W981216 WINBOND [Winbond], W981216 Datasheet - Page 3

• Manufacturer Part Number: W981216
• Description: 2M x 16 bit x 4 Banks SDRAM
• Manufacturer: WINBOND [Winbond]

Pin Assignment
Revision 1.0
23 ~ 26, 22,
29 ~35
20, 21
2, 4, 5, 7, 8,
10, 11, 13,
42, 44, 45,
47, 48, 50,
51, 53
19
18
17
16
39, 15
38
37
1, 14, 27
28, 41, 54
3, 9, 43, 49
6, 12, 46, 52
36, 40
Pin Number
A0~ A11
BS0, BS1
DQ0 ~
DQ15
CS#
RAS#
CAS#
WE#
UDQM/
LDQM
CLK
CKE
V
V
V
V
NC
Pin Name
CC
SS
CC
SS
Q
Q
Address
Bank Select
Data Input/
Output
Chip Select
Row Address
Strobe
Column
Address Strobe
Write Enable
input/output
mask
Clock Inputs
Clock Enable
Power ( +3.3 V )
Ground
Power ( + 3.3 V
) for I/O buffer
Ground for I/O
buffer
No Connection
Function
Multiplexed pins for row and column address.
Row address : A0 ~ A11. Column address: A0 ~ A8.
Select bank to activate during row address latch time, or bank to
read/write during address latch time.
Multiplexed pins for data output and input.
Disable or enable the command decoder. When command
decoder is disabled, new command is ignored and previous
operation continues.
Command input. When sampled at the rising edge of the clock,
RAS#, CAS# and WE# define the operation to be executed.
Referred to RAS#
Referred to RAS#
The output buffer is placed at Hi-Z(with latency of 2) when DQM
is sampled high in read cycle. In write cycle, sampling DQM
high will block the write operation with zero latency.
System clock used to sample inputs on the rising edge of clock.
CKE controls the clock activation and deactivation. When CKE
is low, Power Down mode, Suspend mode, or Self Refresh
mode is entered.
Power for input buffers and logic circuit inside DRAM.
Ground for input buffers and logic circuit inside DRAM.
Separated power from V
noise.
Separated ground from V
noise.
No connection
- 3 -
2M x 16 bit x 4 Banks SDRAM
CC
Description
SS
, used for output buffers to improve
, used for output buffers to improve
Publication Release Date: March, 1999
W981216AH