LH28F160BGH-TL SHARP [Sharp Electrionic Components], LH28F160BGH-TL Datasheet - Page 30
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LH28F160BGH-TL
Manufacturer Part Number
LH28F160BGH-TL
Description
16 M-bit (1 MB x 16) Smart 3 Flash Memories
Manufacturer
SHARP [Sharp Electrionic Components]
Datasheet
1.LH28F160BGH-TL.pdf
(36 pages)
6.2.6 AC CHARACTERISTICS FOR CE#-CONTROLLED WRITE OPERATIONS
NOTES :
1. In systems where CE# defines the write pulse width
2. Sampled, not 100% tested.
3. Refer to Table 2 for valid A
SYMBOL
• V
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
AVAV
PHEL
WLEL
ELEH
PHHEH
SHEH
VPEH
AVEH
DVEH
EHDX
EHAX
EHWH
EHEL
EHRL
EHGL
QVVL
QVPH
QVSL
CC
(within a longer WE# timing waveform), all setup, hold,
and inactive WE# times should be measured relative to
the CE# waveform.
word write.
= 2.7 to 3.6 V, T
Write Cycle Time
RP# High Recovery to CE# Going Low
WE# Setup to CE# Going Low
CE# Pulse Width
RP# V
WP# V
V
Address Setup to CE# Going High
Data Setup to CE# Going High
Data Hold from CE# High
Address Hold from CE# High
WE# Hold from CE# High
CE# Pulse Width High
CE# High to RY/BY# Going Low
Write Recovery before Read
V
RP# V
WP# V
PP
PP
Setup to CE# Going High
Hold from Valid SRD, RY/BY# High
HH
HH
IH
IH
Setup to CE# Going High
Hold from Valid SRD, RY/BY# High
Setup to CE# Going High
Hold from Valid SRD, RY/BY# High
A
= 0 to +70˚C or –25 to +85
PARAMETER
VERSIONS
IN
and D
IN
for block erase or
˚
C
- 30 -
NOTE
2, 4
2, 4
2, 4
2
2
2
2
3
3
4. V
LH28F160BGH-TL10 LH28F160BGH-TL12 UNIT
should be held at V
or word write success (SR.1/3/4/5 = 0 : on Boot Blocks,
SR.3/4/5 = 0 : on Parameter Blocks and Main Blocks).
LH28F160BG-TL10
PP
MIN.
100
100
100
100
10
70
50
50
25
0
0
0
0
0
0
0
0
should be held at V
MAX.
100
HH
LH28F160BG-TL/BGH-TL
) until determination of block erase
PPH1/2
LH28F160BG-TL12
MIN.
120
100
100
100
10
70
50
50
25
0
0
0
0
0
0
0
0
(and if necessary RP#
(NOTE 1)
MAX.
100
ns
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns