M24512-W_12 STMICROELECTRONICS [STMicroelectronics], M24512-W_12 Datasheet - Page 35

• Manufacturer Part Number: M24512-W_12
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M24512-W M24512-R M24512-DR M24512-DF
Figure 17. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package
1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to V
Table 20.
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
D2 (rev MC)
E2 (rev MC)
K (rev MC)
Symbol
connected to any other voltage or signal line on the PCB, for example during the soldering process.
measuring.
eee
A1
L1
L3
A
D
E
b
e
L
(2)
outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
0.550
0.020
0.250
2.000
3.000
0.500
Typ
millimeters
Doc ID 16459 Rev 26
0.450
0.000
0.200
1.900
1.200
2.900
1.200
0.300
0.300
0.300
0.080
Min
0.600
0.050
0.300
2.100
1.600
3.100
1.600
0.500
0.150
Max
0.0217
0.0008
0.0098
0.0787
0.1181
0.0197
Typ
Package mechanical data
SS
inches
. It must not be
0.0177
0.0000
0.0079
0.0748
0.0472
0.1142
0.0472
0.0118
0.0118
0.0118
0.0031
Min
(1)
0.0236
0.0020
0.0118
0.0827
0.0630
0.1220
0.0630
0.0197
0.0059
Max
35/40