M24C04 STMICROELECTRONICS [STMicroelectronics], M24C04 Datasheet - Page 29

• Manufacturer Part Number: M24C04
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M24C16, M24C08, M24C04, M24C02, M24C01
Figure 15. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
3. The circle in the top view of the package indicates the position of pin 1.
Table 21.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
D2 (rev MB)
D2 (rev MC)
E2 (rev MC)
E2 (rev MB)
Symbol
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
measuring.
ddd
A1
L1
L3
A
A
D
E
K
b
e
L
(2)
E
A1
2 x 3 mm, outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
0.55
0.02
0.25
0.05
Typ
1.6
0.2
0.5
D
2
3
-
-
-
millimeters
Doc ID 5067 Rev 16
ddd
0.45
1.45
1.25
Min
0.1
0.2
1.9
1.5
2.9
0.3
0.3
0.3
L3
0
-
-
-
REV MB
D2
Max
0.05
0.15
e
0.6
0.3
2.1
1.7
1.7
3.1
0.3
1.6
0.5
-
-
-
-
b
L1
E2
K
L
0.0098
0.0787
0.0079
0.0217
0.0008
0.1181
0.0197
0.063
0.002
Typ
-
-
-
-
L3
Pin 1
L
Package mechanical data
inches
0.0177
0.0079
0.0748
0.0591
0.0571
0.1142
0.0039
0.0492
0.0118
0.0118
0.0118
REV MC
Min
SS
D2
0
-
-
e
. It must not be
(1)
b
ZW_MEc
0.0236
0.0118
0.0827
0.0669
0.0669
0.0118
0.0197
0.0059
L1
E2
K
0.002
0.122
0.063
Max
-
-
-
-
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