25LC160B-E/SNG MICROCHIP [Microchip Technology], 25LC160B-E/SNG Datasheet - Page 18

• Manufacturer Part Number: 25LC160B-E/SNG
• Description: 16K SPI Bus Serial EEPROM
• Manufacturer: MICROCHIP [Microchip Technology]

25XX160A/B
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
DS21807C-page 18
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Drawing No. C04-086
c
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
b
e
.005" (0.127mm) per side.
See ASME Y14.5M
See ASME Y14.5M
n
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
n
e
L
c
b
MIN
L
.031
.002
.169
.018
.004
.007
.114
0°
–
INCHES
.026 BSC
.252 BSC
12° REF
12° REF
NOM
2
1
.039
.173
.024
.118
D
8
–
–
–
–
–
MAX
.047
.041
.006
.177
.122
.030
.008
.012
8°
A1
A
MIN
0.80
0.05
4.30
2.90
0.45
0.09
0.19
0°
–
© 2006 Microchip Technology Inc.
MILLIMETERS*
0.65 BSC
6.40 BSC
12° REF
12° REF
NOM
1.00
4.40
3.00
0.60
Revised 7-25-06
8
–
–
–
–
–
MAX
A2
1.20
1.05
0.15
4.50
3.10
0.75
0.20
0.30
8°