AT24C256C-PU ATMEL [ATMEL Corporation], AT24C256C-PU Datasheet - Page 13

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AT24C256C-PU

Manufacturer Part Number
AT24C256C-PU
Description
Two-wire Serial EEPROM 256K (32,768 x 8)
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C256C-PUL
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
7.
8568A–SEEPR–11/08
AT24C256C Ordering Codes
Note:
AT24C256C-PU (Bulk Form Only)
AT24C256CN-SH-B
AT24C256CN-SH-T
AT24C256CW-SH-B
AT24C256CW-SH-T
AT24C256C-TH-B
AT24C256C-TH-T
AT24C256CY7-YH-T
AT24C256CU2-UU-T
AT24C256C-W-11
8U2-1
8P3
8S1
8S2
8A2
8Y7
1.8
1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel.
3. Available in tape & reel and wafer form; order as SL788 for inkless wafer form.
EIAJ = 2K per reel.
Bumped die available upon request. Contact Serial Interface Marketing.
(2)
(1)
(2)
(1)
(NiPdAu Lead Finish)
(2)
(NiPdAu Lead Finish)
(1)
(2)
(2)
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.40 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
Low-voltage (1.8V to 5.5V)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Ordering Code
Package Type
Options
Voltage
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
Package
Die Sale
8U2-1
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8Y7
Lead-free/Halogen-free
Industrial Temperature
Industrial Temperature
AT24C256C
Operating Range
(−40°C to 85°C)
(−40°C to 85°C)
13

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