24AA256-EMC MICROCHIP [Microchip Technology], 24AA256-EMC Datasheet
24AA256-EMC
Related parts for 24AA256-EMC
24AA256-EMC Summary of contents
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... Description: The Microchip Technology Inc. 24CXX, 24LCXX, 24AAXX and 24FCXX (24XX*) devices are a family of 128-bit through 512 Kbit Electrically Erased PROMs. The devices are organized in blocks of x8-bit memory with 2-wire serial interfaces. Low-voltage design permits operation down to 1.7V (for 24AAXX devices), with standby and active currents of only 1 μ ...
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TABLE 1-1: DEVICE SELECTION TABLE V Max. Clock CC Part Number Range Frequency 128-bit devices (1) 24AA00 1.7-5.5V 400 kHz (1) 24LC00 2.5-5.5V 400 kHz 24C00 4.5-5.5V 400 kHz 1 Kb devices (2) 24AA01 1.7-5.5V 400 kHz 24LC01B 2.5-5.5V ...
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... TABLE 1-1: DEVICE SELECTION TABLE (CONTINUED) V Max. Clock CC Part Number Range Frequency 128 Kb devices (2) 24AA128 1.7-5.5V 400 kHz 24LC128 2.5-5.5V 400 kHz (3) 24FC128 1.7-5.5V 1 MHz 256 Kb devices (2) 24AA256 1.7-5.5V 400 kHz 24LC256 2.5-5.5V 400 kHz (3) 24FC256 1.7-5.5V 1 MHz 512 Kb devices (2) 24AA512 1.7-5.5V 400 kHz 24LC512 2.5-5.5V 400 kHz (3) 24FC512 1.7-5.5V 1 MHz Note 1: 100 kHz for V < ...
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ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ...
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TABLE 2-2: AC CHARACTERISTICS – ALL EXCEPT 24XX00, 24C01C AND 24C02C AC CHARACTERISTICS Param. Sym. Characteristic No Clock frequency CLK 2 T Clock high time HIGH 3 T Clock low time LOW 4 T SDA and SCL rise ...
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TABLE 2-2: AC CHARACTERISTICS – ALL EXCEPT 24XX00, 24C01C AND 24C02C (CONTINUED) AC CHARACTERISTICS Param. Sym. Characteristic No Output valid from clock AA (Note Bus free time: Time the bus BUF must be free ...
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TABLE 2-3: AC CHARACTERISTICS – 24XX00, 24C01C AND 24C02C All Parameters apply across all Industrial (I): recommended operating ranges Automotive (E): unless otherwise noted Parameter Symbol Clock frequency F CLK Clock high time T HIGH Clock low time T LOW ...
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FIGURE 2-1: BUS TIMING DATA 5 SCL 7 3 SDA SDA OUT WP DS21930B-page (protected) 11 (unprotected © 2007 Microchip Technology Inc. ...
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PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 8-Pin 8-Pin Pin 5-Pin SOT-23 PDIP and TSSOP and Name 24XX00 SOIC MSOP ( ( ...
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FUNCTIONAL DESCRIPTION Each 24XX device supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter, while a device receiving data is defined as a receiver. The ...
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BUS CHARACTERISTICS The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is high. Changes ...
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Acknowledge Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Note: During a write ...
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... B1, B0). They are used by the master device to select which of the 256-word blocks of memory are to be accessed. These bits are in effect the three Most Significant bits of the word address. Note that B2, B1 and B0 are “don’t care” for the 24XX00, the 24XX01 and 24XX02. B2 and B1 are “ ...
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Device Addressing For Devices With Functional Address Pins A control byte is the first byte received following the Start condition from the master device (Figure 5-4). The control byte begins with a 4-bit control code. For the 24XX, ...
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CONTIGUOUS ADDRESSING ACROSS MULTIPLE DEVICES Chip Select bits A2, A1 and A0 can be used to expand the contiguous address space by adding up to eight 24XXs on the same bus. Software can use the three address bits of ...
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... After receiving the ACK from the 24XX acknowledging the final address byte, the master device transmits the data word to be written into the addressed memory location. The 24XX acknowledges again and the master generates a Stop condition, which initiates the internal write cycle ...
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... Stop condition, the master transmits up to one page (1) of bytes , which is temporarily stored in the on-chip page buffer. This data is then written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the internal address counter is incremented by one. If the master should transmit more ...
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ACKNOWLEDGE POLLING Since the device will not acknowledge commands during a write cycle, this can be used to determine when the cycle is complete (This feature can be used to maximize bus throughput). Once the Stop condition for ...
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... Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the byte address must first be set. This is done by sending the byte address to the 24XX as part of a write operation (R/W bit set to ‘ ...
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... Stop condition. To provide sequential reads, the 24XX contains an internal Address Pointer which is incre- mented by one at the completion of each operation. This Address Pointer allows the entire memory con- tents to be serially read during one operation. If the last address byte in the array is acknowledged, the Address Pointer will roll over to address 0x00 ...
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APPENDIX A: REVISION HISTORY Revision A Original release of document. Combined Serial EEPROM 24XXX device data sheets. Revision B (02/2007) Change 1.8V to 1.7V; Removed 14-Lead TSSOP Package; Replaced Package Drawings; Revised Product ID Section. Updates throughout. © 2007 Microchip ...
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... Legend: XX...X Part number or part number code Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) ...
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... Note Temperature range Industrial Extended Legend: XX...X Part number or part number code Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘ ...
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DFN XXX YWW NN 8-Lead 2x3mm DFN Package Marking (Pb-free) Industrial Device Line 1 Device Marking 24AA00 201 24LC00 24AA01 211 24LC01B 24AA014 2N1 24LC014 24AA02 221 24LC02B 24AA024 2P1 24LC024 24AA025 2R1 24LC025 24AA04 231 24LC04B ...
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... NNN 8-Lead 5x6mm DFN Package Marking (Pb-free) Line 1 Device Device Marking 24AA128 24AA128 24LC128 24AA256 24AA256 24LC256 24AA512 24AA512 24LC512 Note: Temperature range (T) listed on second line Industrial Extended Legend: XX...X Part number or part number code Y Year code (last digit of calendar year) ...
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SOT-23 XXNN 5-Lead SOT-23 Package Marking (Pb-free) Comm. Indust. Device Device Marking Marking 24AA00 A0NN B0NN 24LC00 24AA01 A1NN B1NN 24LC01B 24AA02 A2NN B2NN 24LC02B 24AA04 A3NN B3NN 24LC04B 24AA08 A4NN B4NN 24LC08B 24AA16 A5NN B5NN 24LC16B Legend: ...
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... Note Temperature range Industrial Extended Legend: XX...X Part number or part number code Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) ...
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... Note Temperature range Industrial Extended Legend: XX...X Part number or part number code Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) ...
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Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch ...
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Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins ...
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Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE TOP VIEW A3 Number of ...
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Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE TOP VIEW A3 Number ...
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Plastic Small Outline Transistor (OT or CT) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Number of Pins Lead Pitch Outside Lead ...
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Plastic Micro Small Outline Package (MS or UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins ...
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Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch ...
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NOTES: DS21930B-page 36 © 2007 Microchip Technology Inc. ...
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THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web ...
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READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which ...
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PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. X PART NO. X Packaging Device Part Temperature Number Medium Range (Table 1-1) Device: See Table 1-1 Temperature ...
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NOTES: DS21930B-page 40 © 2007 Microchip Technology Inc. ...
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... SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. STATUTORY OR AmpLab, FilterLab, Linear Active Thermistor, Migratable INFORMATION, Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are OR registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM ...
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