24AA256-E/MF MICROCHIP [Microchip Technology], 24AA256-E/MF Datasheet

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24AA256-E/MF

Manufacturer Part Number
24AA256-E/MF
Description
256K I2C CMOS Serial EEPROM
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
Device Selection Table
Features:
• Low-power CMOS technology:
• 2-wire serial interface bus, I
• Cascadable for up to eight devices
• Self-timed erase/write cycle
• 64-byte Page Write mode available
• 5 ms max. write cycle time
• Hardware write-protect for entire array
• Output slope control to eliminate ground bounce
• Schmitt Trigger inputs for noise suppression
• 1,000,000 erase/write cycles
• Electrostatic discharge protection > 4000V
• Data retention > 200 years
• 8-pin PDIP, SOIC, TSSOP, MSOP and DFN
• Pb-free finishes available
• Temperature ranges:
Package Types
*24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices.
© 2005 Microchip Technology Inc.
Note 1:
24AA256
24LC256
24FC256
- Maximum write current 3 mA at 5.5V
- Maximum read current 400 A at 5.5V
- Standby current 100 nA, typical at 5.5V
packages, 14-lead TSSOP package
- Industrial (I):
- Automotive (E):
Number
Note: * Pins A0 and A1 are no connects for the MSOP package only.
Part
2:
V
A0
A1
A2
SS
100 kHz for V
400 kHz for V
1
2
3
4
2.5-5.5V
1.8-5.5V
1.8-5.5V
PDIP/SOIC
Range
V
CC
256K I
CC
CC
8
7
6
5
-40 C to +85 C
-40 C to +125 C
Max. Clock
< 2.5V.
< 2.5V.
Frequency
400 kHz
2
1 MHz
400 kHz
V
WP
SCL
SDA
C
CC
compatible
(2)
2
(1)
24AA256/24LC256/24FC256
C
Ranges
Temp.
CMOS Serial EEPROM
I, E
I
I
V
A0
A1
A2
SS
TSSOP/MSOP*
1
2
3
4
Description:
The Microchip Technology Inc. 24AA256/24LC256/
24FC256 (24XX256*) is a 32K x 8 (256 Kbit) Serial
Electrically Erasable PROM, capable of operation
across a broad voltage range (1.8V to 5.5V). It has
been developed for advanced, low-power applications
such as personal communications or data acquisition.
This device also has a page write capability of up to 64
bytes of data. This device is capable of both random
and sequential reads up to the 256K boundary.
Functional address lines allow up to eight devices on
the same bus, for up to 2 Mbit address space. This
device is available in the standard 8-pin plastic DIP,
SOIC, TSSOP, MSOP and DFN packages.
Block Diagram
SDA
I/O
8
7
6
5
Control
Logic
V
V
I/O
CC
SS
V
WP
SCL
SDA
SCL
CC
A0 A1A2
Memory
Control
Logic
WP
V
A0
A1
A2
SS
XDEC
1
2
3
4
DFN
DS21203N-page 1
8
7
6
5
HV Generator
Page Latches
Sense Amp.
R/W Control
EEPROM
Array
V
WP
SCL
SDA
YDEC
CC

Related parts for 24AA256-E/MF

24AA256-E/MF Summary of contents

Page 1

... SCL SDA SS Note: * Pins A0 and A1 are no connects for the MSOP package only. *24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices. © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 2 ™ C CMOS Serial EEPROM Description: Temp. The Microchip Technology Inc. 24AA256/24LC256/ ...

Page 2

... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...

Page 3

... This eliminates the need for This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site at www.microchip.com. © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 Electrical Characteristics: Industrial (I +1.8V to 5.5V CC ...

Page 4

... AC CHARACTERISTICS (Continued) Param. Sym. Characteristic No Output valid from clock AA (Note Bus free time: Time the bus BUF must be free before a new transmission can start 15 T Output fall time from V OF minimum to V maximum IL C 100 Input filter spike suppression ...

Page 5

... Serial Clock — — — Not Connected Write-Protect Input +1.8V to 5.5V (24AA256) +2.5V to 5.5V (24LC256) +1.8V to 5.5V (24FC256) 2.3 Serial Clock (SCL) This input is used to synchronize the data transfer to and from the device. 2.4 Write-Protect (WP) This pin must be connected to either write operations are enabled. If tied to V ...

Page 6

... BUS CHARACTERISTICS The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line, while the clock line is high, will be interpreted as a Start or Stop condition ...

Page 7

... SCL SDA Data from transmitte Transmitter must release the SDA line at this point, allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data. © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 (D) (D) Address or Data Acknowledge Allowed Valid to Change ...

Page 8

... DEVICE ADDRESSING A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a 4-bit control code. For the 24XX256, this is set as ‘ 1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0) ...

Page 9

... “don’t care” bit K © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 Upon receipt of each word, the six lower Address Pointer bits are internally incremented by one. If the master should transmit more than 64 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be over- written ...

Page 10

... ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (This feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally timed write cycle ...

Page 11

... SDA Line Bus Activity © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 8.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is done by sending the word address to the 24XX256 as part of a write operation (R/W bit set to ‘ ...

Page 12

... Microchip part number, year code, week code, and traceability code. For device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. DS21203N-page 12 Example: 24AA256 I/P e 017 3 0510 ...

Page 13

... NNN 8-Lead MSOP XXXXXT YWWNNN 8-Lead DFN-S XXXXXXX T/XXXXX YYWW NNN Part No. 24AA256 24LC256 24FC256 © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 Example: Example: 4L256I 510017 Example First Line Marking Codes TSSOP Package Codes MSOP Package Codes 4AD 4A256T 4LD 4L256T 4FD ...

Page 14

... Plastic Dual In-line (P) – 300 mil (PDIP Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width ...

Page 15

... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 Units ...

Page 16

... Plastic Small Outline (SM) – Medium, 208 mil (SOIC Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...

Page 17

... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 Units ...

Page 18

... Plastic Micro Small Outline Package (MS) (MSOP (F) Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint (Reference) Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...

Page 19

... Mold Draft Angle Top *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC equivalent: pending Drawing No. C04-113 © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 EXPOSED METAL PADS ...

Page 20

... APPENDIX A: REVISION HISTORY Revision L Corrections to Section 1.0, Electrical Characteristics. Revision M Added 1.8V 400 kHz option for 24FC256. Revision N Revised Sections 2.1 and 2.4. Removed 14-Lead TSSOP Package. DS21203N-page 20 © 2005 Microchip Technology Inc. ...

Page 21

... To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • ...

Page 22

... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 24AA256/24LC256/24FC256 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

Page 23

... Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2005 Microchip Technology Inc. 24AA256/24LC256/24FC256 Examples: / 24AA256-I/P: Package Lead 1.8V, PDIP package. Finish b) 24AA256T-I/SN: Tape and Reel, Industrial Temp., 1.8V, SOIC 2 C Serial package. c) 24AA256-I/ST Serial 1.8V, TSSOP package 24AA256-I/MS: C Serial 1 ...

Page 24

... NOTES: DS21203N-page 24 © 2005 Microchip Technology Inc. ...

Page 25

... Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. ...

Page 26

W ORLDWIDE AMERICAS ASIA/PACIFIC Corporate Office Australia - Sydney 2355 West Chandler Blvd. Tel: 61-2-9868-6733 Chandler, AZ 85224-6199 Fax: 61-2-9868-6755 Tel: 480-792-7200 China - Beijing Fax: 480-792-7277 Tel: 86-10-8528-2100 Technical Support: Fax: 86-10-8528-2104 http://support.microchip.com China - Chengdu Web Address: Tel: ...

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