CBT3861BQ NXP [NXP Semiconductors], CBT3861BQ Datasheet
CBT3861BQ
Related parts for CBT3861BQ
CBT3861BQ Summary of contents
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... Table 1. Ordering information Type Package number Temperature range CBT3861PW −40 °C to +85 °C CBT3861DK −40 °C to +85 °C CBT3861BQ −40 °C to +85 °C [1] Also known as QSOP24 package Name Description TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm [1] SSOP24 plastic shrink small outline package ...
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NXP Semiconductors 4. Functional diagram Fig 1. Logic diagram 5. Pinning information 5.1 Pinning CBT3861 n. A10 11 GND 12 Fig ...
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NXP Semiconductors Fig 4. Pin configuration for DHVQFN24 (SOT815-1) 5.2 Pin description Table 2. Pin description Symbol Pin A10 10, 11 GND B10 22, 21, ...
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NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). − ° ° +85 C, unless otherwise specified. amb Symbol Parameter V supply voltage CC V ...
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NXP Semiconductors Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter R ON resistance ON [1] All typical values are [2] This is the increase in supply ...
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NXP Semiconductors 11. Waveforms Measurement points are given in Logic levels: V and Fig 5. The data input (An, Bn) to output (Bn, An) propagation delay times OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points ...
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NXP Semiconductors 12. Test information Test data is given in Table All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; Z The outputs are measured one at a time with one transition per measurement. ...
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NXP Semiconductors 13. Package outline TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. ...
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NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) A UNIT ...
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NXP Semiconductors DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm terminal 1 index area terminal 1 index area ...
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NXP Semiconductors 14. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model ESD ElectroStatic Discharge HBM Human Body Model PRR Pulse Rate Repetition TTL Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date CBT3861 v.1 ...
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NXP Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales ...
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NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...