LM3668SD-2833 NSC [National Semiconductor], LM3668SD-2833 Datasheet - Page 4

• Manufacturer Part Number: LM3668SD-2833
• Description: 1A, High Efficiency Dual Mode Single Inductor Buck-Boost DC/DC Converter
• Manufacturer: NSC [National Semiconductor]

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V
I
I
I
I
R
R
F
F
V
V
I
LIM
SHDN
Q_PFM
Q_PWM
EN, MODE, SYNC
OSC
SYNC
FB
IH
IL
DSON(P)
DSON(N)
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics
apply over the full operating ambient temperature range (−40°C
the LM3668. V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: Electrical Characteristic table reflects open loop data (FB = 0V and current drawn from SW pin ramped up until cycle by cycle current limits is activated).
Closed loop current limit is the peak inductor current measured in the application circuit by increasing output current until output voltage drops by 10%.
Note 3: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
dissipation of the device in the application (P
following equation: T
Note 4: The Human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5: Junction-to-ambient thermal resistance (θ
JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 101.6mm x 76.2mm x 1.6mm. Thickness of the copper layers are 2oz/1oz/1oz/
2oz. The middle layer of the board is 60mm x 60mm. Ambient temperature in simulation is 22°C, still air.
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special
care must be paid to thermal dissipation issues in board design.
Note 6: All voltage is with respect to SGND.
Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 8: C
PV
Voltage to SGND & PGND
FB, EN ,MODE, SYNC pins:
PGND to SGND
Continuous Power Dissipation
Maximum Junction Temperature
(Note 3)
Symbol
IN,
(T
V
J-MAX
DD
IN
and C
Pin, SW1, SW2 & V
)
IN
OUT
Feedback Voltage
Switch Peak Current Limit
Shutdown Supply Current
DC Bias Current in PFM
DC Bias Current in PWM
Pin-Pin Resistance for PFET
Pin-Pin Resistance for NFET
Internal Oscillator Frequency
Sync Frequency Range
Logic High Input for EN, MODE/
SYNC pins
Logic Low Input for EN, MODES/
SYNC pins
EN, MODES/SYNC pins Input
Current
A-MAX
= 3.6V = EN, V
: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
= T
J-MAX-OP
Parameter
OUT
– (θ
OUT
:
JA
A-MAX
× P
= 3.3V. For V
D-MAX
D-MAX
) is dependent on the maximum operating junction temperature (T
), and the junction-to ambient thermal resistance of the part/package in the application (θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the
Internally Limited
).
(Notes 6, 7)
−0.2V to +6.0V
SGND-0.2V) to
-0.2V to 0.2V
(Note 1)
(PV
OUT
(PGND &
IN
+125°C
= 4.5/5.0V, V
(Note 7)
Open loop(Note 2)
EN =0V
No load, device is not switching
(FB forced higher than
programmed output voltage)
PWM Mode, No Switching
Switches P1 and P2
Switches N1 and N2
PWM Mode
V
+ 0.2)
IN
= 3.6V
Limits in standard typeface are for T
4
Conditions
≤
= T
IN
Operating Ratings
Thermal Properties
Storage Temperature Range
Maximum Lead Temperature
Input Voltage Range
Recommended Load Current
Junction Temperature (T
Ambient Temperature (T
Junction-to-Ambient Thermal Resistance (θ
= 4V.
A
(Note 3)
Leadless Lead frame Package (Note 5)
≤
+85°C). Unless otherwise noted, specifications apply to
(Soldering, 10 sec)
Min
1.6
1.9
1.6
1.1
-3
J-MAX-OP
J
A
) Range
) Range
J
= +25°C. Limits in boldface type
= 125ºC), the maximum power
1.85
0.01
Typ
600
130
100
2.2
0.3
45
−65°C to +150°C
−40°C to +125°C
Max
2.05
750
180
150
2.5
2.7
0.4
60
JA
−40°C to +85°C
JA
3
1
1
), as given by the
),
2.5V to 5.5V
0mA to 1A
34°C/W
+260°C
Units
MHz
MHz
mΩ
mΩ
µA
µA
µA
µA
%
A
V
V