TS4621ML STMICROELECTRONICS [STMicroelectronics], TS4621ML Datasheet - Page 36

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TS4621ML

Manufacturer Part Number
TS4621ML
Description
High-performance class-G stereo headphone amplifier
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Package information
5
36/40
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 73. TS4621ML footprint recommendation
Figure 74. Pinout
INL+
INL-
INR-
INR+
Solder mask opening: Φ = 300 μm min
(for 260 µm diameter pad)
4
PCB pad size: Φ = 260 µm maximum
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
VOUTR
HPVDD
VOUTL
CMS
3
Φ = 220 µm recommended
TOP VIEW
Not soldered
mask opening
AVDD
PVSS
GAIN
C1
2
Doc ID 023181 Rev 1
AGND
EN
SW
Pad in Cu 18 μm with Flash NiAu (2-6 μm, 0.2 μm max.)
C2
1
D
C
B
A
400 μm
D
C
B
A
AGND
SW
400 μm
EN
C2
1
BOTTOM VIEW
AVDD
PVSS
GAIN
C1
2
VOUTR
VOUTL
HPVDD
75 µm min.
100 μm max.
CMS
3
150 μm min.
INR-
INR+
INL+
INL-
TS4621ML
4
Track
®

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