LT5526 LINER [Linear Technology], LT5526 Datasheet - Page 15
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LT5526
Manufacturer Part Number
LT5526
Description
High Linearity, Low Power Downconverting Mixer
Manufacturer
LINER [Linear Technology]
Datasheet
1.LT5526.pdf
(16 pages)
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Company
Part Number
Manufacturer
Quantity
Price
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Manufacturer:
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Quantity:
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Part Number:
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Manufacturer:
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Part Number:
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Manufacturer:
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Quantity:
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PACKAGE DESCRIPTIO
4.35 ± 0.05
2.90 ± 0.05
2.15 ± 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PIN 1
TOP MARK
(NOTE 6)
U
4.00 ± 0.10
(4 SIDES)
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
0.65 BSC
0.30 ±0.05
UF Package
0.72 ±0.05
PACKAGE OUTLINE
0.75 ± 0.05
0.200 REF
0.00 – 0.05
2.15 ± 0.10
(4-SIDES)
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
15
16
0.65 BSC
0.30 ± 0.05
0.55 ± 0.20
LT5526
1
2
(UF) QFN 1103
15
5526f