TEA1520T NXP [NXP Semiconductors], TEA1520T Datasheet
TEA1520T
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TEA1520T Summary of contents
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TEA152x SMPS ICs for low-power systems Rev. 03 — 23 March 2009 1. General description The TEA152x family STARplug is a Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains implemented in ...
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NXP Semiconductors 3. Applications I Chargers I Adapters I Set Top Box (STB) I DVD I CD(R) I TV/monitor standby supplies I PC peripherals I Microcontroller supplies in home applications and small portable equipment, etc. 4. Quick reference data Table ...
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... TEA1522P DIP8 plastic dual in-line package; 8 leads (300 mil) TEA1523P DIP8 plastic dual in-line package; 8 leads (300 mil) TEA1520T SO14 plastic small outline package; 14 leads; body width 3.9 mm TEA1521T SO14 plastic small outline package; 14 leads; body width 3.9 mm TEA1522T SO14 plastic small outline package ...
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NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. 7.2 Pin description Table 3. Symbol V CC GND GND GND GND RC REG AUX GND GND SOURCE n.c. n.c. DRAIN TEA152X_3 Product data sheet DRAIN CC GND ...
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NXP Semiconductors 8. Functional description The TEA152x family is the heart of a compact flyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedback to control the isolated ...
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NXP Semiconductors 8.4 Valley switching A new cycle is started when the primary switch is switched on (see certain time (determined by the oscillator voltage RC and the internal regulation level), the switch is turned off and the secondary stroke ...
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NXP Semiconductors Figure 5 the output voltage V the factor N (determined by the turns ratio of the transformer). system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. ...
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NXP Semiconductors 8.9 OverTemperature Protection (OTP) An accurate temperature protection is provided in the device. When the junction temperature exceeds the thermal shut-down temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. ...
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NXP Semiconductors 9. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins V current driven and pins REG and AUX ...
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NXP Semiconductors 10. Thermal characteristics Table 5. Symbol R th(j-a) [1] Thermal resistance R printed-circuit board. See the TEA152x application notes for details. 11. Characteristics Table over temperature; all voltages are measured with respect ...
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NXP Semiconductors Table over temperature; all voltages are measured with respect to ground; currents are amb positive when flowing into the IC; unless otherwise specified. Symbol Valley switching ( V/ t) vrec f valley ...
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NXP Semiconductors 12. Application information mains R1 Fig 6. Primary sensed application; configuration for TEA152xP Further application information can be found in the TEA152x application notes. 13. Test information 13.1 Quality information This product has been qualified to the appropriate ...
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NXP Semiconductors 14. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...
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NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...
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NXP Semiconductors 15. Abbreviations Table 7. Acronym BiCMOS DMOS ESR EZ-HV SOI FET PWM SMPS SOPS 16. Revision history Table 8. Revision history Document ID Release date TEA152X_3 20090323 • Modifications: The format of this data sheet has been redesigned ...
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NXP Semiconductors 17. Legal information 17.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...