ADG712 AD [Analog Devices], ADG712 Datasheet - Page 4

• Manufacturer Part Number: ADG712
• Description: CMOS Low Voltage 4 ohm Quad SPST Switches
• Manufacturer: AD [Analog Devices]

ADG711/ADG712/ADG713
ABSOLUTE MAXIMUM RATINGS
(T
V
Analog, Digital Inputs
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 430 mW
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG711/ADG712/ADG713 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
Model
ADG711BR
ADG712BR
ADG713BR
ADG711BRU
ADG712BRU
ADG713BRU
DD
Industrial (B Version) . . . . . . . . . . . . . . . . –40 C to +85 C
A
JA
JC
= +25 C unless otherwise noted)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +6 V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 150 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 27 C/W
ADG711 In
0
1
Logic
0
1
Table I. Truth Table (ADG711/ADG712)
Table II. Truth Table (ADG713)
2
ADG712 In
1
0
Switch 1, 4
OFF
ON
(Pulsed at 1 ms, 10% Duty Cycle max)
. . . . . . . . . . . –0.3 V to V
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
Temperature Range
30 mA, Whichever Occurs First
1
Switch Condition
ON
OFF
Switch 2, 3
ON
OFF
DD
+0.3 V or
ORDERING GUIDE
Package Description
0.15" Small Outline (SOIC)
0.15" Small Outline (SOIC)
0.15" Small Outline (SOIC)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
–4–
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 520 mW
Lead Temperature, Soldering
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
limited to the maximum ratings given.
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
JA
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 42 C/W
PIN CONFIGURATION
GND
IN1
IN4
NC
D1
D4
S1
S4
(TSSOP/SOIC)
NC = NO CONNECT
1
2
3
4
5
6
7
8
(Not to Scale)
TOP VIEW
ADG711
ADG712
ADG713
WARNING!
16
15
14
13
12
11
10
9
IN2
D2
S2
V
NC
S3
D3
IN3
DD
Package Option
R-16A
R-16A
R-16A
RU-16
RU-16
RU-16
ESD SENSITIVE DEVICE
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